Ductile grinding mechanism and technology of brittle single crystals

本项目旨在发展一个基本的理解新兴的脆性单晶磨削诱导负荷下的去除机制。一个成功的结果不仅将开发一个新的理论模型，用于预测这类难加工材料的韧性去除制度，但其成本效益的韧性磨削工艺也将产生。它将解决先进制造业长期存在的生产率瓶颈问题。该项目开发的突破性技术预计将使许多工业部门受益，以制造更实惠的高性能设备，包括移动的电话，发光二极管，太阳能电池，传感器和激光系统。

This project aims to develop a fundamental understanding of the removal mechanics of emerging brittle single crystals under grinding-induced loading. A successful outcome will not only develop a new theoretical model for predicting the ductile removal regime of this class of difficult-to-machine materials, but their cost-effective ductile grinding processes will also be generated. It will address a longstanding bottleneck productivity issue in advanced manufacturing. The breakthrough technology developed in the project is expected to significantly benefit a number of industrial sectors for the fabrication of more affordable high-performance devices including mobile phones, light-emitting diodes, solar cells, sensors, and laser systems.