Development of Highly Homogeneous Pellets Applying Electrophoretic Deposition of Ultrafine Abrasive

磨削加工是硬脆材料的一种高效精加工工艺。研制结合强度均匀性好的砂轮是磨削加工表面光滑的重要条件。在此，高度均匀的砂轮在加工过程中实现了粒度自锐，防止了削弱磨削能力的切屑负载和磨粒钝化。我们的前期研究提出了一种新的工艺，即通过电泳沉积带负电荷的磨料来制备高度均匀的砂轮，即超细磨料颗粒。金刚石磨料通常用于硬脆材料的精加工，在溶液中不带负电荷。本研究提出了一种新的技术，利用电泳沉积的磨料，这是不带负电荷的磨料，如金刚石磨料的溶液，当金刚石磨料混合到磨料溶液中时，负电荷，吸附在金刚石磨料上的高度均匀的砂轮。用金刚石磨料研磨后，在电磁场的作用下发生电泳沉积，在阳极上形成金刚石沉积层。在使用直径为2至10 nm的金刚石簇的情况下，在阳极上获得适用于安装轮的薄层。使用layr的精加工实验导致了硅晶片精加工的可行性，但由于小尺寸的船口袋，切屑加载立即发生。因此，认为有必要使用大尺寸的金刚石磨料对颗粒层进行研磨以及扩大切屑槽。实验研究了磨料粒度和结合剂对金刚石沉积层即颗粒特性的影响。

Grinding is a highly efficient finishhing prosess for hard and brittle materias. Developing a grinding wheel with highly homogeneous bonding strength is important to make a smooth surface by grinding. Here, the highly homogeneous grinding wheel brings about grain-sized self-sharpening in the process, preventing the occurrence of swarf loading and grain dulling which weaken the grinding ability. Our previous research proposed a new process to make the highly homogeneous grinding wheel, namely, an ultrafine abrasive pellet, by the application of electrophoretic deposition of the abrasives charged negatively in the solution.Diamond abrasives, commonly used for fine finishing of the hard and brittle materials, are not negatively charged in the solution. This research proposes a new technique to make highly homogeneous grinding wheel using the electrophoretic deposition of the abrasives, which are not negatively charged in the solution, such as the diamond abrasives.When the diamond abrasives are mixed into the polyelectrolyte solution, the polyelectrolyte, negatively charged, is absorbed on the diamond abrasives. The polyelectrolyte with the diamond abrasive shows the electrophoretic deposition under the electromagnetic field, forming the diamond deposition layr on the anode. In case of using the diamond cluster, 2 to 10 nm in diameter, the thin layr which is applicable to a mounted wheel was obtained on the anode. The finishing experiments using the layr resulted in the feasibility of the finishing of a silicon wafer, but the swarf loading was immediately occurred due to the small sized ship pockets. Thereby, it was considered necessary to thicken the layr for the pellets as well as to enlarge the chip pockets using the large sized diamond abrasives. The effects of the abrasive dimeter and the bonding agent on the characteristics of the diamond deposition layr, that is, pellets were experimentally discussed.