Semiconductor coupled SAW device

在本文中，我们研究了saw -半导体耦合集成电路，与两种器件的简单组合相比，它具有优异的特性。我们展示了以下结果。1)在制作工艺方面，我们研究了用于saw -半导体耦合集成电路制作的外延- lift - off薄膜键合工艺，得到了以下结果：我们研究了基本的制作工艺；以更快的速度和无损伤的方式从母衬底上剥离半导体薄膜，表面处理以实现紧密结合，利用x射线形貌澄清结合机理，以及实现大规模生产的一些基本技术。2)器件技术：研究了半导体中SAW与载流子传播产生的电场相互作用和势场分布。在此基础上，我们提出了光信号控制振荡器、可变相位器件等新功能器件。本文还对各种高速无线通信系统的功能器件进行了研究。我们提出了一种高性能的卷积器和可变相关器，并通过实验验证了这些器件的实用性。我们还提出了分布式半导体耦合模拟处理SAW器件，该器件将在未来发挥重要作用。

In this paper, we investigated SAW-semiconductor coupled integrated circuits, which have excellent characteristics compared to devices consisting of a simple combination of two kinds of devices. We have shown the following results.1) As the fabrication technology, we investigated Epitaxial-Lift-Off film bonding process for fabricating the SAW-semiconductor coupled integrated circuit and obtained following results : We have studied basic fabrication process ; higher speed and damage free semiconductor film peeling from its mother substrate, surface treatment for a tight bonding, clarification of bonding mechanism using X-ray topography, and some basic technologies for the way to the mass-productivity.2) Device technology : We studied the interaction between the electric field caused by the propagating SAW and carriers and potential field distribution in a semiconductor. Based on this study, we proposed new function devices such as optical signal controlled oscillator, a variable phase device, and etc. We also studied devices, which are useful for the functional devices for many kinds of high-speed wireless communication systems. We proposed a high performance convolver, variable correletor and verified theusefullness of these devices experimentally. We also proposed distributed semiconductor coupled analog processing SAW device, which will be useful in a future.