A study on plasmaless etchig process for fabrication of micro-systems

本研究主要探讨反应性气体无电浆蚀刻之特性、机制及应用。首先，研究了使用无水氟化氢的退火旋涂玻璃膜的蚀刻特性。接着，明确了三氟化氯对硅、二氧化硅、玻璃状碳的蚀刻特性，作为非等离子体蚀刻工艺的应用，在热型红外线传感器装置中使用了三氟化氯来形成桥接结构。采用多晶硅薄膜作为敏感材料，研制了高灵敏度的测辐射热计器件。接下来，将非等离子体蚀刻工艺应用于太阳能电池的表面织构化。采用三氟化氯微腐蚀的方法在多晶硅衬底上获得了减反射表面。其次，研究了生物传感器的制作工艺。制作了微细胞分选器，通道中的血细胞通过真空蒸发电极施加的介电泳力偏转。研究了一种玻璃基片的粘贴技术，用于制作微通道。通过用稀氟化氢处理和低温退火使玻璃基板彼此粘附。

Properties, mechanism, and application of plasmaless etching, using reactive gases, were mainly investigated in this study. First, etch characteristics of annealed spin-on-glass films using anhydrous hydrogen fluoride were investigated. Next, etch characteristics of silicon, silicon dioxide, and glass-like carbon by chlorine trifluoride were clarified.As an application of plasmaless etching process, chlorine trifluoride was used to form bridge structures in thermal type infrared sensor devices. Highly-sensitive bolometer devices were fabricated using polycrystalline silicon films as a sensing material. Next, the plasmaless etching process was applied to surface texturing of solar cells. Anti-reflective surfaces of polycrystalline silicon substrates were obtained by the slight etching with chlorine trifluoride. Next, fabrication process of biosensors was investigated. Micro-cell sorters were fabricated, and the blood cells in the channel are deflected by dielectrophoretic force, exerted by the vacuum evaporated electrodes. A sticking technique for glass substrates was investigated to make micro-channels. The glass substrates were stuck to each other by the treatment with diluted hydrogen fluoride and low temperature annealing.