Study on the modeling of reactive sputter deposition including the transport process of sputtered and gas particles

研究了反应溅射沉积工艺，以精确控制沉积膜的成分。阐明了溅射金属原子的输运过程和反应气体的粘附几率对溅射过程的影响。特别是前者导致了组分对气体总压的依赖性，这是常规过程模型无法预测的。我们还研究了脉冲功率溅射的特点，这已被证明是能够修改的薄膜结构。

Reactive sputter deposition process has been studied for the precise control of deposited film composition. We clarified the effects of transport process of sputtered metal atoms and sticking probability of reactive gases. Especially, the former leads the dependence of the composition on total gas pressure, which has not been pre-dicted by conventional process models. We also studied the characteristics of pulse power sputtering, which has been proved to be able to modify the film structure.