Simplified models of emissions from electronic systems based on near field measurements

电磁建模是电气设备电磁兼容性表征的重要工具。所有电气设备必须符合国际电磁兼容性标准，以确保其不干扰其他设备或易受外界干扰。仿真软件的使用大大减少了确认符合EMC标准的新设备的设计和开发，因此在整个电气工业中得到广泛应用。随着处理器时钟信号速度的提高和电子器件体积的缩小，对电磁仿真提出了更高的要求。用全三维电磁模拟器完全模拟电子设备的复杂性是不可能的。需要对电子设备进行某种形式的简化。最近由乔治格林电磁学研究所资助的EPSRC项目开发了一种利用近场扫描数据表征印刷电路板（pcb）电磁发射的方法，从而可以构建其行为的简化模型。所建立的模型已被证明适用于电磁模拟器。这项工作非常成功，实现了所有的项目目标，但只在简单的PCB结构和频域上进行了演示。然而，为了使这种方法完全纳入工业部门，它需要涵盖所有常见的PCB结构，它们的互连并扩展到时域方法。该提案将研究扩展迄今为止使用pcb近场扫描开发的技术，以便它可以提供所有常见类型pcb的简化模型，包括它们的互连和将它们的特征组合成完整系统模型的方法。这项工作还将着眼于将该方法扩展到时域的方法。在这方面，希望能够开发出适合全3D电磁模拟器使用的模型，使工程师能够在设计阶段提供EMC特性。

Electromagnetic modelling is an essential tool for electromagnetic compatibility characterisation of electrical equipment. All electrical equipment must satisfy international standards for electromagnetic compatibility (EMC) to ensure that it does not interfere with other equipment or is susceptible to external interference. The use of simulation software greatly reduces the design and development of new equipment that confirms compliance to EMC standards, so it is widely used throughout the electrical industry. The increasing processor clock signal speeds and the decreasing size of electronic devices has made electromagnetic simulation very demanding. It is not possible to fully model the complexity of electronic devices with full 3D electromagnetic simulators. Some form of simplification of the electronic devices is required. A recent EPSRC funded project by the George Green Institute for Electromagnetics Research has developed a way of characterising the electromagnetic emissions from printed circuit boards (PCBs) using near field scan data so that a simplified model of their behaviour can be constructed. The produced models have been demonstrated to be suitable for use in electromagnetic simulators. This work was very successful and achieved all the project objectives, but was only demonstrated on simple PCB structures and in the frequency domain. For this method to be fully incorporated in the industrial sector, however, it needs to encompass all common PCB structures, their interconnects and be extended into a time domain approach. This proposal will research extending the techniques developed so far using near field scans of PCBs so that it can provide simplified models of all common types of PCBs and include their interconnects and a way of combining their characteristics into complete system models. The work will also look at ways of extending the method into the time domain. In this was it is hoped that models suitable for use in full 3D electromagnetic simulators can be developed to enable engineers to provide EMC characterisation at the design stage.