Zero (support) Mass detector development (ZMD)

ZMD计划旨在使用超薄硅制造新型硅探测器模块原型。在像大型强子对撞机这样的粒子物理探测器中，当带电粒子在弯曲的路径上通过探测器时，硅探测器层可以精确地确定它们的位置。通过将这些测量中的点连接起来，这些粒子的动量就被测量了。但在这种探测器中使用的材料越多，特别是在其支撑结构中，粒子偏转的可能性就越大，从而降低了测量的精度。这一问题可以通过ZMD等新技术来解决，这将减少硅探测器层的质量。实现这一目标的主要步骤有两个：第一步是使硅变薄，第二步是通过在晶体中施加应力来支撑薄材料。幸运的是，通过弯曲硅传感器，我们可以使它在很大程度上自给自足，同时对其整体性能的损害最小。这项工作是在蜘蛛WP3计划的基础上进行的，并基于为伦敦玛丽女王大学ATLAS ITK项目开发的专业知识。该计划的成功结果可能会显著缩短硅追踪器的辐射长度。这将转化为对带电粒子轨迹的改进测量，进而导致粒子物理测量的改进。这项工作的自然结果将是对探测器中硅传感器和模块的形状有更深入的了解，这将为对准算法和未来跟踪系统的设计提供信息。这反过来将导致下一代跟踪系统的物理性能有显著提高的潜力。我们将与英国公司美光半导体有限公司密切合作开发这项技术，我们开发这项新技术的成功将对他们的业务以及潜在的其他英国公司产生重大影响。

The ZMD programme aims to make novel silicon detector module prototypes using ultra thin silicon. In particle physics detectors like those at the Large Hadron Collider, silicon detector layers pinpoint the location of charged particles as they pass on curved paths through the detector. By "connecting the dots" from such measurements, the momentum of such particles is measured. But the more material is used in such detectors, and particularly in their support structures, the more likely particles are to be deflected, reducing the precision of the measurement. This problem can be solved by new technology, such as ZMD, that will reduce the mas of silicon detector layers.There are two main steps achieve this: the first is to thin the silicon, and the second is to support the thin material by imposing stress in the crystal. Fortunately, by curving the silicon sensor we can make it self-supporting to a significant degree, while doing minimal damaging to its overall properties.This work follows on from the Arachnid WP3 programme, and builds on expertise developed for the ATLAS ITk project at Queen Mary University of London.A successful outcome of this programme could lead to a significant reduction in radiation length of silicon trackers. This will translate into improved measurements of charged particle tracks; in turn leading to an improvement to measurements made in particle physics. A natural consequence of this work will be a much deeper understanding of the shape of silicon sensors and modules in detectors that will inform the design of alignment algorithms and future tracking systems. This in turn will lead to the potential for significant improvements in physics performance for next generation tracking systems.We will work closely with a UK company, Micron Semiconductor Ltd., in developing this technology, and our success in developing this new technology will have a significant impact on their business and potentially other UK companies as well.