MEMS sensors for harsh environments

开发适合恶劣环境应用的微机电系统（MEMS）是一个新兴的研究领域。拟议的研究计划的目标是开发新的多功能MEMS传感器能够在高温环境下工作。为了实现这一目标，下一代传感器的设计和表征，适当的制造方法，片上集成和传感器封装将进行研究。 许多需要MEMS传感器的应用都是在恶劣的环境中进行的-高温，高辐射和强烈振动的位置，仅举几例。例如，在汽车行业，为了防止与轮胎充气不足相关的翻车事故，需要小型且坚固的多个传感单元来提供高温和强烈振动下的主动轮胎监测。在空间探索中，小型、简单和可靠的传感器系统不需要驻留在环境受控区域，将减少卫星和漫游车的尺寸和重量。因此，可以在恶劣环境中可靠运行的鲁棒且具有成本效益的单芯片MEMS传感器将取代目前使用的笨重且昂贵的传感器系统。 所提出的新的多功能MEMS传感器将使用在高温下表现出良好的机械和热稳定性的材料在单个芯片上制造，例如用于衬底的硅和/或碳化硅（SiC），以及用于传感元件的氮化硅和/或SiC薄膜。该芯片将使用微胶囊进行封装，这将提供额外的保护，并进一步减少传感器系统的尺寸和总重量。该项目将导致多传感器的创新概念，并为适应恶劣环境的MEMS传感器开发新的和/或更好的制造技术。它还将导致传感器可靠性和寿命的突破，这些问题目前限制了MEMS传感器的商业应用。从该计划毕业的学生将在MEMS开发方面拥有丰富的实践经验，并且在现在和可预见的未来都将有很大的需求。

Development of Micro Electro Mechanical Systems (MEMS) tailored to harsh environment applications is a new and emerging area of research. The objective of the proposed research program is to develop new multifunctional MEMS sensors capable of operation in high temperature environments. To achieve this objective, the design and characterization of next generation sensors, appropriate fabrication methods, on-chip integration, and sensor packaging will be investigated.     Many applications that require MEMS sensors take place in harsh environments - locations with high temperature, high radiation and intense vibration, to name a few. For example, in the automotive industry, to prevent rollover accidents linked to under-inflation of tires, small and robust multiple sensing units are needed to provide active tire-monitoring under high temperature and intense vibrations. In space exploration, small, simple and reliable sensor systems that do not need to reside in environmentally controlled areas will reduce the size and weight of satellites and rovers. Hence, robust and cost effective single-chip MEMS sensors that can reliably operate in harsh environments will replace the bulky and expensive sensor systems in use today.     The proposed new multifunctional MEMS sensors will be fabricated on a single chip using materials that exhibit good mechanical and thermal stability at elevated temperatures, such as Silicon and/or Silicon Carbide (SiC) for the substrates, and Silicon Nitride and/or SiC thin films for the sensing elements. The chip will be packaged using a micro-capsule which will provide extra protection and result in further reduction in the size and overall weight of the sensor system. This project will lead to innovative concepts for multiple sensing and the development of new and/or better fabrication techniques for MEMS sensors tailored to harsh environments. It will also lead to breakthroughs in sensor reliability and lifetime, issues that are currently limiting the commercial use of MEMS sensors in general. Students who graduate from this program will have extensive hands-on experience in the development of MEMS and will be in great demand now and the foreseeable future.