Laser micromachining capabilities development

激光材料加工（切割、钻孔、雕刻）具有广泛的潜在应用，包括但不限于薄膜沉积、图案化、烧蚀光刻、材料加工等。当应用于电介质材料时，激光微加工是一种多功能的加工工具，能够在以下方面创造新的产品和市场机会：- 下一代电信组件; -微流体/流式细胞术; -用于医疗保健和生命科学的生物诊断工具和传感器。 为了保持竞争力，保持市场领先地位，并适应不断变化的客户需求帕萨特公司。该项目的目标是开发一种基于皮秒固态紫外激光器的激光微加工工具的初步设计，并利用它开发和原型制作一种高精度切割小晶体的新方法，同时寻求优化工艺质量和产量。该程序将作为未来微加工能力的基准，使公司的新产品/应用的范围和组合。

Laser material processing (cutting, drilling, sculpting) has a wide range of potential applications, including - but not limited to - thin-film deposition, patterning, ablation lithography, material machining, etc. When applied to dielectric materials, laser micromachining is a versatile processing tool capable of creating new products and market opportunities in: -Microelectronic and optoelectronic component manufacturing; -Next generation telecommunications components; -Microfluidics/Flow cytometry; -Biological diagnostic tools and sensors for healthcare and life sciences. In order to be competitive, keep ahead of the market and adapt to changing client needs Passat Inc. must evolve product offerings and add additional capabilities.The project's objective is to develop a preliminary design of a laser micromachining tool based on a picosecond solid-state UV laser and to use it to develop and prototype a novel method of cutting small crystals with high precision while seeking to optimize the process quality and throughput. This procedure will serve as a benchmark for future micromachining capabilities empowering the company's reach and portfolio of new products/applications.