Novel Conductive Adhesives as a Lead-free and Multifunctional Joining Alternative for Electronic Packaging

随着未来的技术创新朝着机器小型化和性能密度最大化的方向发展，相似或不同材料组件的有效连接已成为制造规模越来越小的最关键的技术先决条件之一。本项目的重点是电子制造中的连接工艺，其中含铅焊接技术一直是主导技术。这项传统的焊接技术正受到消费者对更轻和更小设备的日益增长的需求的挑战，以及由于铅对人类和环境的毒性而推动在电子元件中消除铅的使用。在这个项目中，我们与Celestica、Microond和Research in Motion三家工业合作伙伴合作，开发新型导电胶，作为一种无铅连接替代方案，以提供坚固的粘接和多功能性能。为了实现这一技术，我们开发了在导电胶中使用高纵横比或一维纳米级填充物(纳米线和纳米管)的新概念，这些概念不仅可以增强导电胶的机械-热电性能，还可以为电子设备提供自我感知健康监测等“智能”功能。前沿研究将产生连接技术方面的新想法和知识，并通过与工业赞助商的互动和合作，开发使用灵活、环保和具有成本效益的材料和工艺的新的增值连接技术。这一发展将为加拿大电子工业在国际市场上培育至关重要的竞争优势。

As future technological innovations gear towards miniaturizing machines and maximizing performance density, effective joining of similar or dissimilar material components has become one of the most critical technical prerequisites for manufacturing at ever-smaller scales. This project focuses on the joining process in electronics manufacturing where lead-containing soldering technology has been the dominant technology. This conventional soldering technology is being challenged by the increasing demand from consumers for lighter and smaller devices, and the drive to eliminate the use of lead in electronic components due to its toxicity to humans and the environment. In this project, we work with three industrial partners, Celestica, Microbonds and Research In Motion, to develop novel conductive adhesives as a lead-free joining alternative to provide robust bonding and multifunctional properties. To achieve this technology, we have developed new concepts using high aspect-ratio or 1-D nanoscale fillers (nanowires and nanotubes) in conductive adhesives which will not only enhance the mechanical-thermal-electrical properties but also deliver such "smart" functions as self-sensing health monitoring to electronic devices. The cutting-edge research will generate new ideas and knowledge in the joining technology, and, through interactions and collaborations with the industrial sponsors, enable the development of new value-added joining technologies which use flexible, environmentally friendly and cost-effective materials and processes. This development will foster a vital competitive edge for the Canadian electronic industry in the international market place.