Three-Dimensional Integration Methodologies for Bio-MOEMS Using Nanobonding Technology

互补金属氧化物半导体(CMOS)技术的摩尔定律的规模效益受到互连的缺乏规模和连接困难的限制。我们建议使用由碳纳米材料构建的互连，并使用表面激活纳米键合技术进行连接。碳纳米材料的高载流能力使其成为高速微型化生物微光机电系统(Bio-MOEMS)的理想互连材料。表面活化是指从表面清除天然氧化物、碳污染物和颗粒。表面活化纳米键合方法克服了目前键合和封装技术中的贴合困难。这种方法可以在纳米级实现不同材料之间的结合，并具有很高的结合强度。此外，它不需要外部压力、粘合剂、热量或化学物质。此外，它还提供亚微米级的对准精度，以及粘合界面的高导电性和导热性。上述优势的结合是独一无二的。因此，它是Bio-MOEMS所需的三维集成的使能因素。

The scaling benefit of Moore's Law for complementary metal oxide semiconductor (CMOS) technology is limited by the lack of scaling of interconnects and the difficulties in attaching them. We propose the use of interconnects built from carbon nanomaterials and connected using surface activated nanobonding technology. The high current carrying capacity of carbon nanomaterials makes them as an ideal interconnect material for high-speed miniaturized bio-micro-opto-electromechanical systems (Bio-MOEMS). Surface activation refers to the cleaning of native oxides, carbon contaminants and particles from the surface. The surface activated nanobonding method overcomes the attaching difficulties in the current bonding and packaging technologies. This method enables bonding between dissimilar materials at nanometer scale with high bond strength. Also, it requires no external pressure, adhesive, heat, or chemicals. Furthermore, it provides sub-micrometer alignment accuracy, and high electrical and thermal conductivity of the bonded interface. The combination of the above advantages is unique. Therefore, it is an enabling factor for three-dimensional integration, which is required for Bio-MOEMS.