Three-Dimensional Integration Methodologies for Bio-MOEMS Using Nanobonding Technology

用于互补金属氧化物半导体（CMOS）技术的摩尔定律的缩放益处受到互连的缩放的缺乏和附接它们的困难的限制。我们建议使用由碳纳米材料构建的互连，并使用表面活化纳米结合技术连接。碳纳米材料的高载流能力使其成为高速小型化生物微光电机电系统（Bio-MOEMS）的理想互连材料。表面活化是指从表面清除天然氧化物、碳污染物和颗粒。表面活化纳米键合方法克服了现有键合和封装技术中的附着困难。这种方法能够在纳米尺度上以高结合强度实现异种材料之间的结合。此外，它不需要外部压力，粘合剂，热量或化学品。此外，它提供了亚微米的对准精度，以及接合界面的高导电性和导热性。上述优势的结合是独一无二的。因此，它是Bio-MOEMS所需的三维集成的一个有利因素。

The scaling benefit of Moore's Law for complementary metal oxide semiconductor (CMOS) technology is limited by the lack of scaling of interconnects and the difficulties in attaching them. We propose the use of interconnects built from carbon nanomaterials and connected using surface activated nanobonding technology. The high current carrying capacity of carbon nanomaterials makes them as an ideal interconnect material for high-speed miniaturized bio-micro-opto-electromechanical systems (Bio-MOEMS). Surface activation refers to the cleaning of native oxides, carbon contaminants and particles from the surface. The surface activated nanobonding method overcomes the attaching difficulties in the current bonding and packaging technologies. This method enables bonding between dissimilar materials at nanometer scale with high bond strength. Also, it requires no external pressure, adhesive, heat, or chemicals. Furthermore, it provides sub-micrometer alignment accuracy, and high electrical and thermal conductivity of the bonded interface. The combination of the above advantages is unique. Therefore, it is an enabling factor for three-dimensional integration, which is required for Bio-MOEMS.