Femtosecond laser micromachining of GaN

Two-Photon Research是一家总部位于蒙特利尔的公司，专门从事III-V材料及其应用， 用于工业应用的成像。特别是他们有基于GaN半导体的设备。等 半导体生长在晶片上，晶片随后被切割以用于进一步的处理和封装 到设备中。双光子研究的关键工业问题是能够切割GaN晶片， 微米级精度，而不会破坏GaN晶片中的器件和结构。如此干净利落的切割， 对于通常使用的Si晶片，可以使用成熟的机械切割方法。与此相反的是， 机械切割不能以所需的精度加工GaN， 包装和整合。 双光子研究提出了一个工业需求，Kambhampati集团可以很容易地解决。 材料加工领域的最新研究表明，飞秒激光可以切割各种材料， 材料具有前所未有的精度和清洁度的特点。双光子的初步工作， 证实飞秒激光确实可以切割GaN，达到预期的性能目标。然而，在这方面， 他们缺乏进一步优化制造工艺所需的激光和光学专业知识。这种需要 提供了协同合作的机会。 凭借我们的基础设施和专业知识，我们准备迅速满足双光子的工业需求。 Research.我们将专注于公司特定的挑战，这是他们发展的关键路径， 他们的设备。这个具体的挑战是要理解切割光脉冲之间的关系。 半导体，以及切割和微加工的质量。

Two-Photon Research is a Montreal based company that specializes in III-V materials and their applications in imaging for industrial applications. In particular they have devices based on GaN semiconductor. Such semiconductors are grown on wafers which are to be subsequently cut for further processing and packaging into devices. The key industrial problem for Two-Photon Research is to be able to cut the GaN wafers with micron level precision without destroying the devices and structures in the GaN wafer. Such a clean cut is possible for the commonly used Si wafers using well-established mechanical cutting method. In contrast, mechanical cutting is not able to process GaN with the required precision that will enable eventual device packaging and integration. Two-Photon Research has presented an industrial need that the Kambhampati group can readily address. Recent work in the materials processing field has demonstrated that femtosecond lasers can cut a variety of materials with unprecedented precision and cleanliness of features. Two-Photon has initial work that has confirmed that femtosecond lasers can indeed cut their GaN with the desired performance targets. However, they lack the lasers and optics expertise required to further optimize the manufacturing processes. This need presents an opportunity for synergistic collaboration. With our infrastructure and expertise, we are poised to rapidly address the industrial needs of Two-Photon Research. We will focus on a company specific challenge that is on the critical path for their development of their devices. This specific challenge is to understand the relationship between the optical pulses which cut the semiconductors, and the quality of the cutting and micromachining.