Al Electrodeposition to make plated through holes in printed circuit boards using ionic liquids

Omni Circuit Boards是一家位于BC省里士满的印刷电路板制造商， 2008年开发了一种细线铝迹印刷电路板（PCB）， 低温（cryogenic）许多客户对多层版本感兴趣。这 需要PCB各层之间的电连接。目前的产品仅限于单层 限制其市场的应用。 Al将被电沉积在通孔（PTH）的侧面上，这将提供层间电连接。 连通性。需要全铝的电气路径，这将要求电镀通孔被 完全由铝制成。尝试了许多方法，但没有一种成功。本研究 该提案将开发一种使用室温熔融盐（也称为离子液体-IL）的新方法。的 所开发的电解质和方法将容易地转移到工业中。最佳条件为 基于对许多操作参数的系统研究来确定：电流密度，温度， 电解质组成和添加剂的使用等。 沉积层的形态和特性将使用扫描电子显微镜进行研究 通过扫描电镜（SEM/EDS）、X射线衍射（XRD）和光学显微镜（OM）进行分析，以确定样品的组成。 最佳工艺条件最终的目标是在基体上电沉积出致密、光亮、附着力强的铝层。 的PTH的侧面，以确保PCB的电和介电层之间的电连接。

Omni Circuit Boards is a Printed Circuit Board manufacturer located in Richmond, BC which began development of a fine-line aluminum trace printed circuit board (PCB) in 2008 for its superconductive capabilities at low (cryogenic) temperature. Multi-layer versions are of interest to many customers. This requires electrical connectivity between layers of the PCB. The current product is limited to single layer applications which limits its market. Al will be electrodeposited on the sides of the through holes (PTHs) which will provide the interlayer electrical connectivity. The all-aluminum electrical path is required which would demand the plated through hole be constructed entirely of aluminum. Many methods were attempted, but none were successful. This research proposal will develop a new method using room temperature molten salts (also called ionic liquids-ILs). The electrolyte and methods developed will be easily transferred to industry. The optimum conditions will be determined based on systematic studies of the many operating parameters: current density, temperature, electrolyte composition and use of additives etc. The morphology and characteristics of the deposited layer will be investigated using scanning electron microscopy (SEM/EDS), X-Ray Diffraction (XRD) and optical microscopy (OM) so as to determine the optimum process conditions. The ultimate goal is to electrodeposit dense, bright and adherent Al layers on the sides of of PTHs, so as to ensure electrical connections between the electric and dielectric layers of PCBs.