Dicing saw for optoelectronics and sensors

我们需要一台高速、高精度的自动切片锯，能够精确切割半导体晶片，并将微米级结构精确铣削成各种基片。具有这两种功能的切割锯是任何需要芯片切割，高精度子单元或精确功能的研究小组的基本处理工具，例如片上光子源和波导，第三代光伏设备，非线性光学系统或生物传感器。它是加工设备的重要组成部分，用于各种应用的设备制备和后处理。虽然该提案的所有共同申请人（Turak, Xu, Bradley, Knights, Soleymani）将使用拟议的设备，但他们将将其应用于各种前沿领域，分为三类：集成光电子和通信材料和设备，生物兼容传感和监测；和转型光伏。该工具将被安置在麦克马斯特新兴设备技术中心（CEDT）内，该中心是专门从事材料、设备、系统和处理协议开发的核心研究机构。这也将使麦克马斯特和当地附近的许多（2010年至2020年）团体可以在特别的基础上使用该中心。缺乏可靠的切割设备极大地限制了共同申请人在国际竞争研究领域及时发表论文的能力。有了这样一个工具，共同申请者将能够推动高性能激光器的能力，改善用于超高速通信的光芯片-光纤耦合，小型化手持生物传感器，并改造第三代光伏发电。

We request a high-speed, high accuracy automatic dicing saw, capable of precision cutting of semiconductor wafers, and precision milling of micron scale structures into various substrates. A dicing saw with these two capabilities is a fundamental processing tool for any research group requiring chip dicing, high precision sub-units, or precise features, such as on-chip photonic sources and waveguides, 3rd generation photovoltaic devices, nonlinear optical systems or biosensors. It is an essential piece of processing equipment, used for both device preparation and post-processing for a wide variety of applications. While all the co-applicants in this proposal (Turak, Xu, Bradley, Knights, Soleymani) will utilize the proposed equipment, they will apply it to a broad variety of cutting edge sectors, grouped into three categories: Materials and Devices for Integrated Photonics and Communications, Bio-compatible Sensing and Monitoring; and Transformative Photovoltaics. This tool will be housed within the McMaster Centre for Emerging Device Technology (CEDT), a core research facility specializing in the development of materials, devices, systems and processing protocols. This will also make it available to numerous (>20) groups at McMaster and in the local vicinity, who are user members of the Centre, on an ad hoc basis. The lack of reliable access to the dicing equipment has drastically limited the ability of the co-applicants to publish in a timely manner within internationally competitive areas of research. With such a tool, the co-applicants will be able to push the capabilities of high performance lasers, improve optical chip-fiber coupling for ultra-fast communications, miniaturize hand-held biosensors, and transform third generation photovoltaics.