Advanced Cooling Technologies for Microsystems

拟议项目的目标是通过继续与Systemex Energy和East-West制造公司发展高效的研究伙伴关系，为大功率电子元件的冷却创造创新的高性能解决方案。拟议项目的成果将包括与现代制造基础设施兼容的可靠技术，并提供一条经济的途径，以满足对节能数据中心和超高功率微处理器日益增长的需求。拟议研究中的主要新概念是在低压封闭式热虹吸管中使用新的电镀多孔铜涂层，以在风冷微处理器中实现最先进的性能。因此，拟议的研究将填补在这些热虹吸管的可靠性、设计方法和适当制造技术方面的知识空白，以及在用于优化能源管理的微型制造设备流动方面的空白。

The goal of the proposed project is to create innovative high-performance solutions for the cooling of high power electronic components, by continuing the development of a highly efficient research partnership with Systemex Energies and East-West Manufacturing. The outcomes of the proposed project will comprise reliable technologies that are compatible with modern manufacturing infrastructures and that provide an economical path to meeting the growing demand for energy-efficient data centers and for very high power microprocessors. The principal new concepts in the proposed research are to use a new electroplated porous copper coating in low-pressure closed thermosiphons to achieve state-of-the-art performance in air-cooled microprocessors. The proposed research will thus fill knowledge gaps on the reliability, design methodologies and proper manufacturing techniques of these thermosiphons, as well as gaps on flows in microfabricated devices used to optimize energy management.