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Presidential Young Investigator Award: An Intelligent Planning Environment for Dimensional Inspection

Presidential Young Investigator Award: An Intelligent Planning Environment for Dimensional Inspection
总统青年研究员奖:尺寸检测智能规划环境
批准号:
8957722
负责人:
Chia-Hsiang Menq
金额:
$31.2万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1989
资助国家:
美国
项目状态:
已结题
起止时间:
1989-11-01 至 1994-10-31

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中文摘要
翻译
这项研究的目的是双重的。 第一 目的是开发一种自动尺寸检测 用于制造对象的系统。 第二个目标是 开发智能化的检查规划环境。 这些 两个目标将从几个跨学科的解决 在自动化技术的多个层面上, 从设施自动化到信息和决策 自动化. 自动化工作,包括坐标测量 三坐标测量机(CMM)和计算机数控(CNC)机床。 计算机辅助设计/计算机辅助 制造(CAD/CAM)系统和集成数据库 信息水平和人工智能(AI)技术 在决策一级,建议促进 柔性制造中自动化检测的集成 系统.
英文摘要
The objective of this research is twofold. The first objective is to develop an automated dimensional inspection system for manufactured objects. The second objective is to develop an intelligent inspection planning environment. These two objectives will be addressed from several interdisciplinary perspectives and at several levels of automation technology, ranging from the facility automation to information and decision automation. Automation efforts, including coordinate measurement machines (CMM), and computer numerical control (CNC) machines at the facility level, computer aided design/computer aided manufacturing (CAD/CAM) systems and integrated databases at the information level, and artificial intelligence (AI) technologies at the decision-making level, are proposed to facilitate the integration of automated inspection in flexible manufacturing systems.
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会议论文
Ultra-precise Coordinate Metrology of Three-dimensional Objects at Micrometer and Nanometer Scales
  • 批准号:
    1200017
  • 项目类别:
    Standard Grant
  • 资助金额:
    $46.5万
  • 财政年份:
    2012
  • 负责人:
    Chia-Hsiang Menq
  • 依托单位:
Six-Axis Visual Sensing and Visual Servo Control Rendering Direct Metrology for Manipulation of Multiple Micro Objects
  • 批准号:
    1067962
  • 项目类别:
    Standard Grant
  • 资助金额:
    $46.72万
  • 财政年份:
    2011
  • 负责人:
    Chia-Hsiang Menq
  • 依托单位:
Modeling and Control of Magnetically Actuated Compliant Micromanipulators Enabling Multi-axis Scanning of 3D Micro/Nano Objects
A Coordinate Measuring Machine for Three-Dimensional Micro Devices
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