Dry Plating Apparatus and Process Development

干镀设备和工艺开发

• 批准号: 9301881
• 负责人: Mandar Sunthankar
• 金额: $ 25万
• 依托单位: IonEdge Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1994
• 资助国家: 美国
• 起止时间: 1994-09-15 至 1996-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9301881&HistoricalAwards=false
• 关键词: Dry; Plating; Apparatus; Process; Development

Electroplating of fasteners generates large amounts of solid and liquid waste. A unique dry plating method has been developed to address this concern. This method eliminates liquid chemicals and minimizes solid waste. A process model has been successfully developed that predicts the cumulative effect of independent process variables on the deposition rate and the grain size. The data generated has indicated that the dry plating is a promising and safe alternative to electrochemical plating. A cadmium dry plating apparatus suitable for plating fasteners will be developed and the environmental and occupational safety standards of this process will be investigated. The dry plating process will be developed and modeled to study the quality of the coatings which are needed in the fastener industry. If this quality can be obtained in an environmentally safe manner, the dry plating has a substantial potential for plating large quantities of fasteners.

紧固件电镀会产生大量的固体和液体废物。一种独特的干镀方法已经被开发出来解决这个问题。这种方法消除了液体化学品，并最大限度地减少了固体废物。成功地建立了一个过程模型来预测独立过程变量对沉积速率和晶粒尺寸的累积效应。结果表明，干镀是电化学镀的一种安全可行的替代方法。研制了一种适用于紧固件电镀的镉干镀装置，并对该工艺的环境和职业安全标准进行了研究。将开发干镀工艺并建立模型，以研究紧固件工业所需涂层的质量。如果能以一种环保安全的方式获得这种质量，干式电镀在电镀大量紧固件方面具有很大的潜力。