Colloidal Processing and Microstructural Design of Glass- Ceramic Composites

玻璃陶瓷复合材料的胶体加工和微观结构设计

• 批准号: 9309073
• 负责人: Prashant Kumta
• 金额: $ 9万
• 依托单位: Carnegie-Mellon University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-07-01 至 1996-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9309073&HistoricalAwards=false
• 关键词: Colloidal; Processing; Microstructural; Design; Glass

Prashant Kumta Abstract The current and future emphasis in packaging technology are aimed at achieving high device densities. These development place stringent requirements on substrate technology. The substrates need to possess good heat dissipation and signal propagation characteristics. Several compromises seem to be essential to match the device output characteristics with the economics of the process. A composite material with optimum thermal and dielectric properties would offer an ideal solution to this problem. A colloidal processing technique combined with a unique microstructural design is proposed to process a glass-ceramic composite with optimum thermal and electrical properties. Modified metal oxide sol-gel (MOSG) process utilizing inexpensive metal oxide precursors is proposed to synthesize borophosphosilicate glass-ceramics. An in-situ solution coating technique will be used to introduce the thermally conducting second phase. Systematic control of the processing parameters such as temperature, solution viscosity, sintering time, and volume fraction will be initiated to generate a duplex microstructure in the dense composite containing a continuous network of the thermally conducting phase. The three main objectives of the proposed study are: (1) Synthesis of the glass-ceramic composite material using the modified solution approach (2) Systematic study and control of the evolved microstructure of the glass-ceramic composite and (3) To understand the effect of the gel structure and the process variables (volume fraction, coating thickness, gel structure, sintering time, temperature) on the microstructure and its properties, using thermal analyses, X-ray diffraction, scanning and transmission electron microscopy. The effect of the microstructure on the electrical and thermal properties will also be assessed by measuring the dielectric constant, thermal expansion and thermal conductivity of the dense composites. The present approach offers a novel method to process dual phase composites with a contiguous microstructure and can be easily extended to process other glass- ceramic, ceramic-ceramic or metal- ceramic composites for electronic and structural application. ***

Prashant库姆塔摘要 封装技术的当前和未来重点是实现高器件密度。 这些发展对基板技术提出了严格的要求。 基板需要具有良好的散热和信号传播特性。 几个妥协似乎是必不可少的，以匹配设备的输出特性与经济的过程。 具有最佳热性能和介电性能的复合材料将为这个问题提供理想的解决方案。 提出了一种结合独特的微结构设计的胶体加工技术，以加工具有最佳热性能和电性能的玻璃陶瓷复合材料。 采用廉价的金属氧化物溶胶-凝胶（MOSG）法制备硼磷硅酸盐微晶玻璃。 将使用原位溶液涂覆技术来引入导热第二相。 系统控制的工艺参数，如温度，溶液粘度，烧结时间，和体积分数将被启动，以产生在致密的复合材料中包含的导热相的连续网络的双重微观结构。 拟议的三个主要目标 研究包括：（1）使用改进的溶液方法合成玻璃-陶瓷复合材料（2）系统地研究和控制玻璃-陶瓷复合材料的演变的微观结构和（3）理解凝胶结构和工艺变量的影响（体积分数、涂层厚度、凝胶结构、烧结时间、温度）对微观结构及其性能的影响，使用热分析，X射线衍射、扫描和透射电子显微镜。 还将通过测量致密复合材料的介电常数、热膨胀和热导率来评估微观结构对电性能和热性能的影响。 本方法提供了一种加工具有连续微结构的双相复合材料的新方法，并且可以容易地扩展到加工用于电子和结构应用的其他玻璃-陶瓷、陶瓷-陶瓷或金属-陶瓷复合材料。 ***