CAREER: A Faculty Early Career Development Proposal in Electronic Materials
职业生涯:电子材料领域教师早期职业发展建议
基本信息
- 批准号:9502117
- 负责人:
- 金额:$ 33.11万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Continuing Grant
- 财政年份:1995
- 资助国家:美国
- 起止时间:1995-07-01 至 2000-06-30
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
9502117 Goorsky This research program aims to develop a deeper understanding of the connection between microscopic materials structure and performance in compound semiconductors. The relationship among substrate properties, initial defect nucleation, and device performance in GaAs- and InP-based heterostructures will be studied. The role of substrate perfection and substrate miscut on the initial stages of misfit dislocation formation and related defects in strained epitaxial structures will be explored as well as the behavior of layers grown under either tensile or compressive strain. This will help develop a fundamental understanding of precisely how the magnitude and sign of stress in the layers influences the formation of defects. %%% This research will contribute to improving the general performance and to the realization of advanced devices and integrated circuits used in computing, information processing, and telecommunications. An important feature of the program is the training of graduate and undergraduate students in a fundamentally and technologically significant area of materials and processing research. ***
9502117 Goorsky该研究计划旨在更深入地了解化合物半导体中微观材料结构和性能之间的联系。 将研究GaAs和InP基异质结构中衬底性质、初始缺陷成核和器件性能之间的关系。衬底的完善性和衬底上的失配位错形成的初始阶段和应变外延结构中的相关缺陷的误切的作用将被探索,以及拉伸或压缩应变下生长的层的行为。 这将有助于对层中应力的大小和符号如何影响缺陷的形成有一个基本的了解。这项研究将有助于提高一般性能和实现先进的设备和集成电路用于计算,信息处理和电信。 该计划的一个重要特点是在材料和加工研究的基本和技术重要领域培养研究生和本科生。 ***
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Mark Goorsky其他文献
Strain Analysis of CdTe on InSb Epitaxial Structures Using X-ray-Based Reciprocal Space Measurements and Dynamical Diffraction Simulations
- DOI:
10.1007/s11664-018-6566-1 - 发表时间:
2018-08-10 - 期刊:
- 影响因子:2.500
- 作者:
Michael Liao;Calli Campbell;Cheng-Ying Tsai; Yong-Hang Zhang;Mark Goorsky - 通讯作者:
Mark Goorsky
Laser-Assisted Chemical Polishing of Silicon (112) Wafers
- DOI:
10.1007/s11664-012-2130-6 - 发表时间:
2012-06-01 - 期刊:
- 影响因子:2.500
- 作者:
Niru Dandekar;Robert Chivas;Scott Silverman;Xiaolu Kou;Mark Goorsky - 通讯作者:
Mark Goorsky
Mark Goorsky的其他文献
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{{ truncateString('Mark Goorsky', 18)}}的其他基金
Workshop on Compound Semiconductor Materials & Devices (WOCSEMMAD) 2013 Date: February 17-20, 2013 Location: Pavillon Hotel, New Orleans, Louisiana
化合物半导体材料研讨会
- 批准号:
1324512 - 财政年份:2013
- 资助金额:
$ 33.11万 - 项目类别:
Standard Grant
GOALI: Materials Integration of III-V Compounds for Electronic Device Applications
GOALI:用于电子设备应用的 III-V 族化合物的材料集成
- 批准号:
0408715 - 财政年份:2004
- 资助金额:
$ 33.11万 - 项目类别:
Continuing Grant
Development of a High Resolution X-Ray Analysis Facility forAdvanced Materials
先进材料高分辨率 X 射线分析设备的开发
- 批准号:
9208766 - 财政年份:1992
- 资助金额:
$ 33.11万 - 项目类别:
Standard Grant
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