Acquisition of Instrumentation for Research and Development of Bonded Ultra Thin Silicon Wafers
收购用于研究和开发键合超薄硅片的仪器
基本信息
- 批准号:9601937
- 负责人:
- 金额:$ 20.26万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:1996
- 资助国家:美国
- 起止时间:1996-09-15 至 1998-02-28
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
9601937 Farmer Building on their strong research program on silicon wafer processing, micromachining, microelectromechanical systems (MEMS), electrical and optical characterization, and related areas over the past eighteen months, NJIT researchers have investigated specifically the process of bonding ultra-thin silicon wafers (as thin as 2 micrometers), a product of Virginia Semiconductor, Inc. (VSI), to virgin and oxidized silicon substrates. This work has recently culminated in a joint patent application for a bonded structure using ultra-thin silicon, and a commitment by VSI to supply ultra-thin wafers for continued research, both on the processes and mechanisms of ultra-thin wafer bonding, and on MEMS, silicon-on-insulator (SOI) and silicon-on-silicon (SOS) applications. Through the Academic Research Infrastructure Program, NJIT is seeking to expand its research efforts in ultra-thin silicon wafer bonding. ***
9601937农民建立在他们强大的研究计划,在硅晶片加工,微机械加工,微机电系统(MEMS),电气和光学特性,以及相关领域在过去的18个月,NJIT的研究人员已经调查了具体的过程中结合超薄硅晶片(薄至2微米),弗吉尼亚半导体公司的产品。(VSI)到原始的和氧化的硅衬底。 这项工作最近在使用超薄硅的键合结构的联合专利申请中达到高潮,VSI承诺提供超薄晶圆用于继续研究,包括超薄晶圆键合的工艺和机制,以及MEMS,绝缘体上硅(SOI)和硅上硅(SOS)应用。 通过学术研究基础设施计划,NJIT正在寻求扩大其在超薄硅片键合方面的研究工作。 ***
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Kenneth Farmer其他文献
Kenneth Farmer的其他文献
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{{ truncateString('Kenneth Farmer', 18)}}的其他基金
Acquisition of Instrumentation for Deep Reactive Ion Etching of Ultra-Thin Bonded Wafers
购置超薄键合晶圆深度反应离子蚀刻仪器
- 批准号:
9871272 - 财政年份:1998
- 资助金额:
$ 20.26万 - 项目类别:
Standard Grant
CAREER: Ultra-Thin Oxides on Silicon and Thin Silicon Wafer Bonding
职业:硅上超薄氧化物和薄硅晶圆键合
- 批准号:
9624798 - 财政年份:1996
- 资助金额:
$ 20.26万 - 项目类别:
Standard Grant
Tunneling Measurements for Electro-Structural Analysis of Ultra-thin Dielectrics on Silicon
用于硅上超薄电介质电结构分析的隧道测量
- 批准号:
9313937 - 财政年份:1993
- 资助金额:
$ 20.26万 - 项目类别:
Continuing grant
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