Packaging of Microelectronic Devices: Short Courses for Undergraduate Faculty Enhancement

微电子器件封装：本科师资能力提升短期课程

• 批准号: 9653375
• 负责人: Guna Selvaduray
• 金额: $ 9.97万
• 依托单位: San Jose State University Foundation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-01-15 至 1999-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9653375&HistoricalAwards=false
• 关键词: Packaging; Microelectronic; Devices; Short; Courses

Four one-week long short courses on Microelectronic Packaging will be offered over a two year period, in June and July, during Years I and II. Microelectronic packaging, which is the technology of encapsulating semiconductor devices, is an interdisciplinary field which requires knowledge from several traditional engineering and science disciplines. The subject matter of the short course will be of interest to faculty in electrical, mechanical, materials and industrial engineering. Hands-on laboratory exercises will be a major component of the course, which will emphasize multi-disciplinary package design, long term reliability and manufacturing operations. A field trip to a local Silicon Valley industry will enhance the learning process. Examples of how the short course material can be integrated into existing curricula will be provided. Follow through support will be provided for participants to assist them in introducing these concepts at their home institutions. This will be monitored on an on-going basis, via questionnaires and direct email contact. Problems faced, solutions developed - especially innovative ones - new laboratory exercises developed, and other pertinent information will be compiled and distributed to all participants in the form of a periodic newsletter. SJSU's College of Engineering will serve as a depository for this material. A manual on "Laboratory Exercises in Microelectronic Packaging" will be prepared and provided to participants. This will also be made available to other interested university faculty. An independent evaluator will conduct, compile and distribute course evaluations by participants.

四个为期一周的微电子封装短期课程将提供超过两年的时间，在六月和七月，在第一年和第二年。 微电子封装是封装半导体器件的技术，是一个跨学科的领域，需要多个传统的工程和科学学科的知识。短期课程的主题将是感兴趣的教师在电气，机械，材料和工业工程。 动手实验练习将是课程的主要组成部分，它将强调多学科封装设计，长期可靠性和制造操作。 实地考察当地硅谷产业将加强学习过程。 将提供如何将短期课程材料纳入现有课程的实例。 将为参与者提供后续支持，帮助他们在本国机构介绍这些概念。 这将通过问卷调查和直接电子邮件联系持续监测。 所面临的问题、所制定的解决办法-特别是创新的解决办法-所制定的新的实验室练习以及其他有关资料将加以汇编，并以定期通讯的形式分发给所有与会者。 SJSU的工程学院将作为这些材料的存放处。 将编写一份关于“微电子封装实验室练习”的手册并提供给与会者。 这也将提供给其他感兴趣的大学教师。 一名独立的评价员将进行、汇编和分发学员对课程的评价。