Structure and Stress Evolution in Polycrystalline Thin Films

多晶薄膜的结构和应力演化

• 批准号: 9710139
• 负责人: Carl Thompson
• 金额: --
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Continuing grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-08-15 至 2003-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9710139&HistoricalAwards=false
• 关键词: Structure; Stress; Evolution; Polycrystalline; Thin

9710139 Thompson This is an experimental and theoretical research effort on the evolution of structure and the mechanical state of polycrystalline films during thin metal film deposition and during subsequent thermal processing. The goal of the research is to develop models and simulations which can be used to predict the course of grain size, grain orientation and stress evolution as a function of substrate, film and capping layer material properties, while also considering the deposition conditions and subsequent thermal history. The stresses in films deposited on substrates are monitored using wafer curvature measurements made while heating at controlled and variable rates and while annealing at different temperatures for different times. Film material, capping layers, film thickness, and film deposition temperature are among the varied parameters in these experiments. In situ TEM observations explore grain structure evolution in heated films on thin substrates which impose a strain in the films due to differential thermal expansion. Texture of the films is monitored by X-ray analyses. %%% As modeling and simulation capabilities evolve through comparison with experiments, new quantitative capabilities are developed for predicting grain structure, grain orientation, and stress evolution. This provides techniques for processing of films with properties that are optimized for specific engineering applications. Polycrystalline films are used in electronic, micromechanical, and magnetic devices. In these applications, the performance and reliability of polycrystalline films are strongly affected by their structure, specifically the distribution of grain sizes and crystallographic orientations. ***

小行星9710139 这是一个实验和理论研究工作的演变过程中的结构和多晶薄膜的机械状态的金属薄膜沉积和随后的热处理。 该研究的目标是开发模型和模拟，可用于预测晶粒尺寸，晶粒取向和应力演化的过程作为衬底，薄膜和覆盖层材料特性的函数，同时还考虑沉积条件和随后的热历史。 在基板上沉积的薄膜的应力进行监测，同时在控制和可变的速率加热，而在不同的温度下退火不同的时间，使用晶片曲率测量。 在这些实验中，膜材料、覆盖层、膜厚度和膜沉积温度是变化的参数。 在原位TEM观察探讨晶粒结构的演变，在加热的薄膜薄基板上施加的薄膜中的应变，由于差热膨胀。 通过X射线分析监测膜的纹理。 %随着建模和仿真能力的发展，通过与实验的比较，开发了新的定量能力，用于预测晶粒结构，晶粒取向和应力演变。这提供了用于加工具有针对特定工程应用优化的性质的膜的技术。 多晶薄膜用于电子、微机械和磁性器件。 在这些应用中，多晶薄膜的性能和可靠性受到其结构的强烈影响，特别是晶粒尺寸和晶体取向的分布。 ***