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CAREER: Interface and Reliability Studies of MEMS and Microelectronics Using New MEMS Instruments

CAREER: Interface and Reliability Studies of MEMS and Microelectronics Using New MEMS Instruments
职业：使用新型 MEMS 仪器进行 MEMS 和微电子学的接口和可靠性研究
批准号：
9734368
负责人：
Taher Saif
金额：
$26.0万
依托单位：
University of Illinois at Urbana-Champaign
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
1998
资助国家：
美国
项目状态：
已结题
起止时间：
1998-06-01 至 2003-05-31
来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=9734368&HistoricalAwards=false
关键词：
CAREERInterfaceReliabilityStudiesMEMS

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英文摘要
9734368 Saif This proposal is focused on experimentally studying one of the commonly occurring failure modes in MEMS and micro electronics, namely debonding between interfaces, often referred to as decohesion. The interface formed by submicron films of a metal (aluminum) and an insulator (silicon dioxide) will be studied. To carry out the experiments, micro instruments will be developed based on MEMS devices. These instruments will initiate debonding in test specimens designed for interfacial studies.They will also self calibrate, and will allow measurements of Angstrom to nanometer scale displacements of the specimens. The micro instrument and the test specimens will be simultaneously designed, patterned and cofabricated. ***
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