Integrated Mesoscopic Electro-Mechanical Manufacturing

DMI-9800434 LIN集成介观机电制造是传感器和执行器设计和制造中的一个关键问题。介观机械结构(100微米到几毫米)是宏观系统(如“机电系统”)和微观系统(如“微电子机械系统(MEMS)”)之间的桥梁。尽管已经展示了许多用于制造机电系统和MEMS的工艺，但很少有工艺涉及集成介观机电制造的问题。该项目的目标是：(1)开发介观机械结构的批量制造工艺；(2)将介观机械部件与微电子技术相结合。为了实现这些目标，将建立几个关键工艺，包括精密模具插件的制造、牺牲层复制、结构层复制以及最终的机电一体化。这项研究可能会带来新的知识和技术，这些知识和技术对介观范围内集成传感器和执行器的设计和制造非常重要。

DMI-9800434 Lin Integrated mesoscopic electro-mechanical manufacturing is a critical issue in design and manufacturing of sensors and actuators. Mesoscopic mechanical structures (100 micrometers to a few millimeters) are bridges between the macroscopic systems such as "mechatronics systems" and the microscopic systems such as "microelectromechanical systems (MEMS)." Although numerous processes have been demonstrated for the manufacturing of mechatronics systems and MEMS, very few of them have addressed the issues of integrated mesoscopic electro-mechanical manufacturing. The objectives of this project are to: (1) Develop a batch manufacturing process for mesoscopic mechanical structures, and (2) Integrate mesoscopic mechanical components with microelectronics. Several key processes will be established to achieve these objectives, including fabrication of precision mold insert, sacrificial layer replication, replication of structural layer, and final electro-mechanical integration. The research will likely lead to new knowledge and techniques which are important to the design and manufacturing of integrated sensors and actuators in the mesoscopic range.