SBIR Phase I: Laser Direct-Writing Technique to Produce Integrated Optical Amplifier/Splitter

SBIR第一阶段：激光直写技术生产集成光放大器/分光器

• 批准号: 0109853
• 负责人: Douglas Taylor
• 金额: $ 9.95万
• 依托单位: TPL, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-07-01 至 2001-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0109853&HistoricalAwards=false
• 关键词: SBIR; Phase; Laser; Direct; Writing

This Small Business Innovation Research (SBIR) Phase I project will develop integrated optical amplifier/splitters through direct writing of sol-gel-derived, erbium-doped coatings. Since optical signals decrease with transmission and manipulation, amplifiers are required. Current designs involve serial arrangements of passive (splitters) and active devices (amplifiers). This serial design is bulky and expensive, due to the number of components and interconnects. Integrated optical devices would greatly simplify optical communication networks. Phase I will incorporate amplification into passive devices, such as splitters, resulting in lossless optical devices. To provide amplification, erbium will be incorporated into ceramic films via wet-chemical processing. Subsequently, laser irradiation will selectively densify channels in porous coatings, thereby locally increasing the refractive index and providing light containment in the channels. Pumping the planar device will amplify signals as they pass.This technology in integrated amplifier/splitters will be key to making more complex integrated optical circuits in telecommunication.

该小型企业创新研究（SBIR）第一阶段项目将通过直接写入溶胶-凝胶衍生的掺铒涂层开发集成光放大器/分路器。 由于光信号随着传输和操作而减少，因此需要放大器。 目前的设计涉及无源（分路器）和有源器件（放大器）的串联布置。 由于组件和互连的数量，这种串行设计体积庞大且昂贵。 集成光学器件将大大简化光通信网络。 第一阶段将把放大纳入无源器件，如分光器，从而产生无损光学器件。 为了提供放大，铒将通过湿化学处理并入陶瓷膜中。 随后，激光照射将选择性地使多孔涂层中的通道致密化，从而局部地增加折射率并在通道中提供光容纳。 泵浦平面器件将在信号通过时放大信号。集成放大器/分离器中的这项技术将是制造更复杂的电信集成光路的关键。