SBIR Phase I: Micromachined Ultrasonic-on-a-Chip for Medical High-Resolution Imaging

SBIR 第一阶段：用于医疗高分辨率成像的微机械超声波芯片

• 批准号: 0213863
• 负责人: Eli Wiener-Avnear
• 金额: $ 10万
• 依托单位: Leeoat Company
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-07-01 至 2002-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0213863&HistoricalAwards=false
• 关键词: SBIR; Phase; Micromachined; Ultrasonic; Chip

This Small Business Innovation Research (SBIR) Phase I project objective is to research and develop the next generation of ultrasound real-time volumetric imagers, with enhanced spatial resolution and picture definition. The innovation is based on LEEOAT Company's patented micromachining technology and its expertise in parallel high-density electronic interconnections to innovate the Ultrasound-on-a-Chip (UOC) device. In phase I of the SBIR program, LEEOAT Company will design the device and demonstrate the fabrication feasibility of the crucial components, thus demonstrating the proof-of-concept of the UOC imaging system. Additionally, LEEOAT Company will theoretically simulate the UOC device and the support electronics for performance optimization and to predict the anticipated final performance of the imager. Finally, the cost/effort will be estimated for the final development, fabrication and testing of the UOC imaging system prototype for medical applications.The major commercial application involves ultrasonic noninvasive medical imaging. Industrial applications include non-destructive evaluations such as defect identification in integrated circuits.

该小型企业创新研究（SBIR）第一阶段项目的目标是研究和开发下一代超声实时体积成像仪，具有增强的空间分辨率和图像清晰度。该创新基于LEEOAT公司的专利微加工技术及其在并行高密度电子互连方面的专业知识，以创新片上超声（UOC）设备。在SBIR计划的第一阶段，LEEOAT公司将设计设备并证明关键部件的制造可行性，从而证明UOC成像系统的概念验证。此外，LEEOAT公司将从理论上模拟UOC设备和支持电子设备的性能优化，并预测成像仪的预期最终性能。最后，将估计用于医疗应用的UOC成像系统原型的最终开发、制造和测试的成本/工作量。主要商业应用涉及超声无创医学成像。工业应用包括非破坏性评估，例如集成电路中的缺陷识别。