SBIR Phase I: Micromachined Ultrasonic-on-a-Chip for Medical High-Resolution Imaging

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This Small Business Innovation Research (SBIR) Phase I project objective is to research and develop the next generation of ultrasound real-time volumetric imagers, with enhanced spatial resolution and picture definition. The innovation is based on LEEOAT Company's patented micromachining technology and its expertise in parallel high-density electronic interconnections to innovate the Ultrasound-on-a-Chip (UOC) device. In phase I of the SBIR program, LEEOAT Company will design the device and demonstrate the fabrication feasibility of the crucial components, thus demonstrating the proof-of-concept of the UOC imaging system. Additionally, LEEOAT Company will theoretically simulate the UOC device and the support electronics for performance optimization and to predict the anticipated final performance of the imager. Finally, the cost/effort will be estimated for the final development, fabrication and testing of the UOC imaging system prototype for medical applications.The major commercial application involves ultrasonic noninvasive medical imaging. Industrial applications include non-destructive evaluations such as defect identification in integrated circuits.