NER: Solvent Assisted Atomic Layer Deposition

未来的纳米级电子器件技术（包括先进的分子、生物和磁性器件）将使用比当前器件更广泛的材料。先进的器件还需要对不同材料之间界面的键合结构进行精密控制，对工艺和加工条件提出严格要求。 人们对原子层沉积（ALD）技术越来越感兴趣，原子层沉积（ALD）技术能够对沉积薄膜进行原子级控制，以在各种纳米尺度和纳米电子器件中实现感兴趣的材料的高度共形和平滑沉积。 对于这个项目，我们建议证明使用溶剂化能作为一种新的可能的反应。在原子层沉积工艺中。 将使用超临界溶剂（特别是CO2）来促进吸附在沉积表面上的金属有机前体的还原来证明该概念。 为这一为期一年的努力所选择的特定示范并不构成一个完全集成或可扩展的沉积过程。 相反，演示的目的是显示实施和利用溶剂化力效应，以实现原子级控制的原子平滑，纳米级共形电子薄膜的沉积的可行性。 一个成功的示范将促使更多的扩展工作，以实现更成熟和硬件密集型的沉积工具和方法，是这个简短的探索项目的范围之外。 这项工作最密切地解决了纳米级制造工艺的主题。 它专门解决有关的问题。新的工具。在纳米级制造，开发新的概念，高速率的合成和纳米结构的加工，和放大的纳米级合成和加工方法。 该项目将利用PI在薄膜沉积工艺的基础研究和实践演示方面的经验。 PI实验室提供了一个新的集成真空沉积/表征系统，该系统具有广泛的表面表征工具，包括表面电子光谱和红外吸收光谱，并将用于演示和理解与拟议工艺相关的特定详细机制。 这项工作将产生超出特定研究成果的更广泛影响。除了研究生和博士后将在这个项目中工作的教育收益，PI将利用这一努力来帮助扩展他的研究生/本科化学工程课程。电子材料的化学加工。以包括对基于溶剂的工艺在纳米尺度材料和器件制造中的可能应用的讨论。 一个探索性的本科实验室也将开发，以补充课程材料。

Future nano-scale electronic device technologies (including advanced molecular, biological, and magnetic devices) will utilize a much wider range of materials than found in current devices. Advanced devices will also require exquisite control over bond structure at interfaces between dissimilar materials, placing stringent demands on processes and processing conditions. There is growing interest in atomic layer deposition (ALD) techniques that enable atomic-level control over depositing thin films, to achieve highly conformal and smooth deposition of materials of interest in a variety of nano-scale and nano-electronic devices. For this project, we propose to demonstrate the use of solvation energy as a new possible reaction .driver. in an atomic layer deposition process. This concept will be demonstrated using a supercritical solvent (specifically CO2) to facilitate reduction of a metal-organic precursor adsorbed on a deposition surface. The particular demonstration chosen for this one-year effort does not constitute a completely integrated or scalable deposition process. Rather, the demonstration is designed to show feasibility of implementing and utilizing solvation force effects to achieve atomic level control in deposition of atomically smooth, nano-scale conformal electronic thin films. A successful demonstration will prompt more expanded work required to achieve more mature and hardware-intensive deposition tools and methods that are outside the scope of this short exploratory project. This work most closely addresses the theme of Manufacturing Processes at the Nanoscale. It specifically addresses issues related to .novel tools.for manufacturing at the nanoscale, developing novel concepts for high-rate synthesis and processing of nanostructures,.and scaleup of nanoscale synthesis and processing methods.. The project will take advantage of, and build upon, the PI.s experience in fundamental studies and practical demonstration of thin film deposition processes. A new integrated vacuum deposition/characterization system with a wide range of surface characterization tools, including surface electron spectroscopy and infrared absorption spectroscopy, is available in the PI.s lab, and will be used to demonstrate and understand the particular detailed mechanisms associated with the proposed process. This work will have broader impacts beyond the particular research results. In addition to the education benefit received by the graduate student and post-doc that will work on this project, the PI will use this effort to help expand his graduate/undergraduate Chemical Engineering course .Chemical Processing of Electronic Materials. to include discussion of possible applications of solvent-based processes in nano-scale materials and device fabrication. An exploratory undergraduate lab will also be developed that to supplement the course material.