SGER: High Performance MEMS Metals Developed by Solidification Processing of Composite Coatings and Embedded Layers

SGER：通过复合涂层和嵌入层的固化处理开发的高性能MEMS金属

• 批准号: 0342735
• 负责人: Peter Wong
• 金额: $ 9.2万
• 依托单位: Tufts University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-08-15 至 2004-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0342735&HistoricalAwards=false
• 关键词: SGER; Performance; MEMS; Metals; Developed

This SGER focuses on an innovative process and materials that can solve (1) reliability problems due to surface effects, (2) high-temperature post-processing, and (3) packaging in multi-layer devices. The materials are high performance Ni-Al and Ti-Al thin films that can coat surfaces or be embedded in structures. Here we propose to initiate a reaction to create either Ni-Al or Ti-Al intermetallics in-situ with minimal intervention to the fabrication process/equipment. These materials have good corrosion resistance, high temperature strength, and, in the case of Ti-Al, good biocompatibility with potential applications in BioMEMS. The proposed research will involve both thermal modeling and experimental validation. The largest challenge is in optimization of the Ni-Al and Ti-Al deposition thickness and laser and infrared heating parameters to trigger the reaction without harming the rest of the silicon structures. The team will adapt and use a transient melting/solidification model, which will ultimately be expanded to include reaction kinetics and the possibility of atomic level deposition.This SGER will result in the development of high performance intermetallics for interlayer/interconnects in multi-layer and multi-chip MEMS devices, utilizing an innovative, realistic thermal process that can be added to standard microfabrication lines. In addition, an advanced thermal model of intermetallic solidification processing will be created. The graduate students in this project will benefit from strong, interdisciplinary collaboration between two universities, as well as the opportunity to create exciting demonstrations for undergraduate courses

该SGER着重于可以解决（1）由于表面影响引起的可靠性问题的创新过程和材料，（2）高温后处理以及（3）多层设备中的包装。这些材料是高性能的Ni-al和Ti-Al薄膜，可以涂层表面或嵌入结构中。在这里，我们建议发起一种反应，以最小的干预措施在制造过程/设备上创建Ni-Al或Ti-Al金属层。这些材料具有良好的耐腐蚀性，高温强度，并且在Ti-Al中具有良好的生物相容性，具有潜在的生物元素。 拟议的研究将涉及热建模和实验验证。最大的挑战是优化Ni-Al和Ti-Al沉积厚度以及激光和红外加热参数，以触发反应而不会损害其余的硅结构。 The team will adapt and use a transient melting/solidification model, which will ultimately be expanded to include reaction kinetics and the possibility of atomic level deposition.This SGER will result in the development of high performance intermetallics for interlayer/interconnects in multi-layer and multi-chip MEMS devices, utilizing an innovative, realistic thermal process that can be added to standard microfabrication lines.此外，将创建一个高级金属间凝固处理的热模型。该项目中的研究生将受益于两所大学之间的强大的跨学科合作，以及为本科课程创建令人兴奋的示威活动的机会