SGER: High Performance MEMS Metals Developed by Solidification Processing of Composite Coatings and Embedded Layers

SGER：通过复合涂层和嵌入层的固化处理开发的高性能MEMS金属

• 批准号: 0342735
• 负责人: Peter Wong
• 金额: $ 9.2万
• 依托单位: Tufts University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-08-15 至 2004-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0342735&HistoricalAwards=false
• 关键词: SGER; Performance; MEMS; Metals; Developed

This SGER focuses on an innovative process and materials that can solve (1) reliability problems due to surface effects, (2) high-temperature post-processing, and (3) packaging in multi-layer devices. The materials are high performance Ni-Al and Ti-Al thin films that can coat surfaces or be embedded in structures. Here we propose to initiate a reaction to create either Ni-Al or Ti-Al intermetallics in-situ with minimal intervention to the fabrication process/equipment. These materials have good corrosion resistance, high temperature strength, and, in the case of Ti-Al, good biocompatibility with potential applications in BioMEMS. The proposed research will involve both thermal modeling and experimental validation. The largest challenge is in optimization of the Ni-Al and Ti-Al deposition thickness and laser and infrared heating parameters to trigger the reaction without harming the rest of the silicon structures. The team will adapt and use a transient melting/solidification model, which will ultimately be expanded to include reaction kinetics and the possibility of atomic level deposition.This SGER will result in the development of high performance intermetallics for interlayer/interconnects in multi-layer and multi-chip MEMS devices, utilizing an innovative, realistic thermal process that can be added to standard microfabrication lines. In addition, an advanced thermal model of intermetallic solidification processing will be created. The graduate students in this project will benefit from strong, interdisciplinary collaboration between two universities, as well as the opportunity to create exciting demonstrations for undergraduate courses

该SGER专注于创新工艺和材料，可以解决(1)由于表面效应引起的可靠性问题，(2)高温后处理，以及(3)多层器件中的封装。这些材料是高性能的Ni-Al和Ti-Al薄膜，可以覆盖表面或嵌入结构中。在这里，我们建议在对制造工艺/设备进行最小干预的情况下，在原位产生Ni-Al或Ti-Al金属间化合物。这些材料具有良好的耐腐蚀性，高温强度，并且在Ti-Al的情况下，具有良好的生物相容性，在生物医学领域具有潜在的应用前景。提出的研究将包括热建模和实验验证。最大的挑战是优化Ni-Al和Ti-Al沉积厚度以及激光和红外加热参数，以在不损害其余硅结构的情况下触发反应。该团队将适应并使用瞬态熔化/凝固模型，最终将扩展到包括反应动力学和原子水平沉积的可能性。该SGER将导致多层和多芯片MEMS器件中用于层间/互连的高性能金属间化合物的开发，利用创新的，现实的热工艺，可以添加到标准微加工线中。此外，还将建立一种先进的金属间凝固过程热模型。该项目的研究生将受益于两所大学之间强有力的跨学科合作，并有机会为本科课程创造令人兴奋的演示