Development of a Novel "Punch" Method to Characterize Thin Film Adhesion: Applications in Life-Sciences and MEMS

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Development of a Novel "Punch" Method to Characterize Thin Film Adhesion: Applications in Life-Sciences and MEMSA comprehensive solid-mechanics model will be constructed for the adherence between a cylindrical flat punch and a thin bio- or electronic membrane clamped at the circular circumference. The elastic and viscoelastic constitutive relations will be derived to investigate thin film adhesion-delamination under both quasi-static and cyclic loading at elevated temperature, using a new state-of-art nano-Bionix-laparoscope system and a new dynamic mechanical analyzer (DMA) configuration with microns and micro-Newton resolutions. The critical force, punch displacement and contact radius at "pull-off" (spontaneous detachment of sample film from punch substrate) will be related to the interfacial adhesion energy and residual membrane stress. The new adhesion mechanics is useful in understanding time-dependent cell adhesion and locomotion. A corresponding 1-D rectangular model will be constructed for a MEMS-RF-switch, aiming at investigating the electromagnetic-mechanical coupling and its effects on the operational parameters, and formulating new design criteria.