Development of a Novel Punch Method to Characterize Thin Film Adhesion: Applications in Life-Sciences and MicroElectroMechanical Systems (MEMS)

一个全面的固体力学模型将被构建为一个圆柱形的平冲头和一个薄的生物或电子膜夹在圆周之间的粘附。的弹性和粘弹性本构关系将推导出调查薄膜的粘附分层下，在高温下的准静态和循环载荷，使用一个新的国家的最先进的纳米Bionix腹腔镜系统和一个新的动态力学分析仪（DMA）配置微米和微牛顿分辨率。临界力、冲头位移和“拉脱”时的接触半径（样品膜与冲头基底的自发分离）将与界面粘附能和残余膜应力相关。新的粘附机制是有用的理解时间依赖性的细胞粘附和运动。为研究MEMS射频开关的电磁-机械耦合及其对工作参数的影响，建立了MEMS射频开关的一维矩形模型，并提出了新的设计准则。

A comprehensive solid-mechanics model will be constructed for the adherence between a cylindrical flat punch and a thin bio- or electronic membrane clamped at the circular circumference. The elastic and viscoelastic constitutive relations will be derived to investigate thin film adhesion-delamination under both quasi-static and cyclic loading at elevated temperature, using a new state-of-art nano-Bionix-laparoscope system and a new dynamic mechanical analyzer (DMA) configuration with microns and micro-Newton resolutions. The critical force, punch displacement and contact radius at "pull-off" (spontaneous detachment of sample film from punch substrate) will be related to the interfacial adhesion energy and residual membrane stress. The new adhesion mechanics is useful in understanding time-dependent cell adhesion and locomotion. A corresponding 1-D rectangular model will be constructed for a MEMS-RF-switch, aiming at investigating the electromagnetic-mechanical coupling and its effects on the operational parameters, and formulating new design criteria.