The mechanical behavior of hybrid organic/inorganic structures for flexible electronics

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The mechanical behavior of hybrid organic/inorganic structures for flexible electronicsABSTRACTThis project will develop experiments and models to understand the mechanical behavior of organic/inorganic hybrid structures of small features, as motivated by the nascent field of flexible electronics. To focus on fundamental mechanics of materials and structures, the project will study the response of inorganic films on organic substrates under monotonic and cyclic loads. Specific issues that will be addressed include ductility of metal films on polymer substrates, with emphasis on using microstructures and adhesion to markedly increase the ductility of the metal films; and cracking in ceramic films on polymer substrates, with emphasis on developing an experimental method to determine crack driving force, and on studying initiation of the cracks and the effects of inelastic deformation of the substrates. Both sets of issues have emerged in the recent development of flexible electronics, and pose fundamental challenges to the mechanics of materials and structures.