Advanced Sensors for Millimeter-Wave Detection and Imaging [UND_FY06_008]

毫米波探测和成像是一个发展迅速的领域，具有商业和国家安全两个方面的应用。本研究的重点是高性能后向二极管探测器和成像阵列的设计和演示。异质结后向二极管已被证明在室温下性能优于现有的探测器。这些设备在安全、航空电子和信号检测方面的应用前景看好，它们可以通过烟雾、雾霾和不透明材料(如用于远程化学和爆炸检测的织物)进行成像。除了成像，传感器还是电子数据收集系统的一部分，用于信号的检测、分类和分析。探测器不需要冷却即可获得重大的灵敏度增强，从而降低了成本并提高了效率。探测器和阵列的改进来自于器件设计和数值模拟的跨学科计划，以及器件的基于制造和测量的模型。该项目涉及本科生和研究生，并将产生一系列课程充实的案例学生。用于电子应用的半导体材料的持续发展使广泛的学科和应用受益。这种传感器技术的衍生应用包括通信、高性能无线网络、医学成像、天文学和普通计量学。

Millimeter-wave detection and imaging is a rapidly developing field with both commercial and national security applications. This research is focused on the design and demonstration of high performance backward diode detectors and imaging arrays. The heterostructure backwards diode has been shown to outperform existing detectors at room temperature. The devices are promising for applications in security, avionics and signal detection, where they can image through smoke, haze, and opaque materials such as fabric for remote chemical and explosion detection. In addition to imaging, the sensors are part of systems for electronic data collection, in detection, categorization and analysis of signals. The detectors do not require cooling to obtain major sensitivity enhancements, which reduces cost and increases efficiency. Improvements in detectors and arrays come through an interdisciplinary program of device design and numerical simulation, coupled with fabrication and measurement-based models for the devices. The project engages undergraduate and graduate students and will generate a series of case students for curricular enrichment. The continued development of semiconductor materials for electronic applications benefits a broad spectrum of disciplines and applications. Spin-off applications of this sensor technology include communication, high-performance wireless networking, medical imaging, astronomy and general metrology.