Collaborative Research: Focused Electric Field Induced Ion Transport: A Patterning Process

该合作研究项目的目标和方法是使用一种新的非接触式图案压印方法来解决制造微米级和可能亚微米级表面特征的成本和环境因素。该工艺基于聚焦电场诱导的离子传输，能够以诱人的拥有成本压印小型化和微米级的特征。该方法采用电化学电池，其中阴极具有用阳离子选择性离子传导柔性膜包围电解液的空腔。初步结果表明，与目前的技术相比，提出的技术具有几个优点。这个项目的重点是发展对基本过程机制的机械性理解。然后，将利用所获得的见解将这一过程扩展到亚微米制度。如果成功，这一工艺将为微米和亚微米尺寸的特征和部件提供独特的、对环境无害的工艺。这一进程将响应迅速增长的需求，大幅节省非常不同的行业的制造成本，这些行业包括电子系统、主动控制的光学设备、汽车、通信和微型卫星、医药和生物技术、空中和陆基家庭安全和反恐系统的微型探测器。该项目将为研究生和本科生提供设计和操作微米级和亚微米级材料去除过程的新方法。这些工艺的基本原理将被纳入微米和纳米图案技术的非传统方法的新课程课程中。将通过开发一个模拟和控制该过程的软件试验台，并通过万维网提供，从而实现对所获得的见解的广泛传播。

The objective and approach of this Collaborative Research project is to use a novel non-contact pattern imprinting methodology to address the cost and environmental elements of manufacturing micron and possibly sub-micron scale surface features. The process is based on focused electric field induced ion transport, which is capable of imprinting miniaturized and micron size features at an attractive cost of ownership. The process employs an electrochemical cell, wherein the cathode has a cavity enclosing the electrolyte with a cation-selective ion-conducting flexible membrane. Preliminary results indicate several advantages of the proposed technique over the current technology. This project focuses on developing a mechanistic understanding of the fundamental process mechanisms. The gained insights will then be utilized to extend the process to the submicron regime. This process, if successful, would provide unique, environmentally benign process for micron- and sub-micron sized features and components. This process would respond to a rapidly increasing demand with significant manufacturing cost saving among very diverse industries, including electronic systems, actively controlled optics, automotive, communications and micro-satellites, medicine and biotechnology, micro-probes for air and land-based home security and counter terrorism systems. The project will provide exposures for graduate and undergraduate students to novel methods of designing and manipulating micron- & sub-micron scale material removal processes. The fundamentals of the processes will be incorporated into a new course curriculum in non-traditional approaches to micro and nano-patterning technology. Wide dissemination of the insights gained will be achieved by developing a software test bed for simulation and control of the process, and making it available through the World Wide Web.