Self-assembled Inductors: A New Paradigm in Nanoelectronics Design

自组装电感器：纳米电子设计的新范式

• 批准号: 0727100
• 负责人: Hongbin Yu
• 金额: $ 65万
• 依托单位: Arizona State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-09-01 至 2011-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0727100&HistoricalAwards=false
• 关键词: Self; assembled; Inductors; New; Paradigm

AbstractFor the past decades, technology scaling has been the driving force for the worldwide semiconductor industry. With the relentless reduction of transistor's feature size, industry has achieved larger-scale of integration, higher operation speed, and lower fabrication cost. However, the scaling of passive devices such as inductors, which are vital for communication and computation chips, is tremendously lagging behind. Consequently, the major portion of today's communication chip is occupied by the inductors, not active transistors. The intrinsic nature of the current planar lithographic technology limits the utility of the components that are more efficient with 3D structures. A properly designed and fabricated 3D spiral inductor with much smaller size could produce comparable performance a large planar inductor of several hundred microns square would. DNA scaffold-based assembling strategy has been demonstrated to form versatile, including 3D structures, and additional functionalities can be designed and incorporated into the assembly through specific chemical recognition groups. Combined with parallel process to integrate functional structures onto wafer and into circuits, they offer many opportunities that could greatly improve system's performance. This research involves the fundamental synthesis and integration of DNA-directed self-assembled inductors (SAIs), and the novel circuit applications rendered by this potential new capability. Specifically, the investigators study: 1) the chemical synthesis of 3D DNA spirals, and the attachment of various nanoparticles and therefore, different functionalities, to the DNA spirals; 2) the development of reliable ways to achieve parallel integration of such SAIs onto wafer surface and to form electrical connections to the leads, and further testing of the inductor performances; 3) the behavior of these novel inductors using simulation tools, and novel circuit designs based on the 3D SAIs.

摘要在过去的几十年里，技术规模一直是全球半导体行业的驱动力。随着晶体管特征尺寸的不断缩小，工业上实现了更大规模的集成、更高的运算速度和更低的制造成本。然而，电感等对通信和计算芯片至关重要的无源器件的规模远远落后于此。因此，今天的通信芯片的大部分被电感占据，而不是有源晶体管。当前平面光刻技术的固有特性限制了利用3D结构更高效的组件的使用。设计和制造合理的尺寸小得多的3D螺旋电感可以产生与几百微米正方形的大平面电感相当的性能。基于DNA支架的组装策略已经被证明可以形成包括3D结构在内的多种功能，并且可以通过特定的化学识别基团来设计和整合额外的功能。与将功能结构集成到晶片和电路上的并行工艺相结合，它们提供了许多机会，可以极大地提高系统的性能。这项研究涉及DNA定向自组装电感(SAI)的基本合成和集成，以及这一潜在的新能力所带来的新的电路应用。具体地说，研究人员研究了：1)3D DNA螺旋的化学合成，以及各种纳米粒子以及因此不同功能的纳米粒子与DNA螺旋的附着；2)开发可靠的方法，将此类SAI平行集成到晶片表面并形成与引线的电连接，并进一步测试电感性能；3)使用仿真工具研究这些新型电感的行为，以及基于3D SAI的新颖电路设计。