CAREER-EHS: Thermal-Aware Task Scheduling for Embedded Planar and 3D Chip Multiprocessors

许多移动嵌入式系统都被设计得小巧紧凑，以利于便携性。随着用户对更强大、更多功能和更集成的解决方案的需求不断扩大，由于技术的进步，设计者努力将越来越多的设备封装到小型嵌入式外形中。与这一趋势相平行的是，微处理器技术已经演变成2D和3D空间的多核处理器时代。正如可以预见的那样，未来嵌入式系统和未来微处理器的结合带来了显著提高功率密度的幽灵，这使得散热管理成为嵌入式处理器的一个关键挑战。这个职业项目解决了这一挑战，并寻求创新的解决方案来解决嵌入式芯片多处理器(CMPS)的散热问题。这项研究的目标是开发主动的热管理技术，防止温度上升到阈值以上，同时避免性能节流。这与传统技术不同，传统技术只对散热违规做出反应，并通过强制执行性能调节来冷却处理器。所提出的技术利用不同应用程序之间的热行为的自然差异，并在多个核之间进行调度，以将芯片温度保持在给定的预算内。这种调度的任务是最大限度地减少芯片上所有内核的热违规，提高性能，并减少由过热引起的问题，如降低可靠性、低电路速度和高泄漏功率。该项目的教育部分力求在一个紧密结合的框架内培训来自不同领域和不同背景的学生。目标是在嵌入式系统、微体系结构、操作系统和软件分析领域为未来的职业建立广泛的熟悉度和准备。

Many mobile embedded systems are designed to be small and compact to favor portability. As the user demand expands for more powerful, versatile, and integrated solutions, the designers endeavor to pack more and more devices into small embedded form factors, thanks to technology advancement. In parallel with this trend, the microprocessor technology has evolved into an era of multicore processor in both 2D and 3D space. As can be foreseen, the marriage of future embedded systems and future microprocessors raises the specter of dramatically increased power density that renders thermal management a key challenge for embedded processorsThis CAREER project addresses this challenge and seeks innovative solutions to tackle thermal problems for embedded chip multiprocessors (CMPs). The objective of this research is to develop proactive thermal management techniques that prevent the temperature from increasing above the threshold and yet avoid performance throttling. This is in contrast to traditional techniques, which only react to thermal violations, and do so by enforcing performance throttling to cool down the processor. The proposed techniques leverage the natural discrepancies in thermal behavior among different applications, and schedule them among multiple cores to keep the chip temperature within a given budget. The mission of such scheduling is to minimize thermal violations across all cores on-chip, improve performance, and diminish overheating-induced problems such as reduced reliability, low circuit speed, and high leakage power. The education component of this project seeks to train students from different fields and with different backgrounds in a tightly integrated framework. The goal is to establish broad familiarity and preparedness for future professions in the field of embedded systems, micoarchitectures, operating systems and software analysis.