MRI-R2: Acquisition of Precision Wafer Aligner / Bonder for 3-D Integrated Nano-Opto-Electromechanical Systems (NOEMS).

“该奖项是根据2009年美国复苏和再投资法案（公法111-5）资助的”这项研究的目标是在纳米和微米尺度上集成光学，电气和机械系统，从而实现新颖的生物医学，能量收集和结构健康监测设备和系统，否则是不可能的。该方法是使用晶圆对准器和键合机系统对包括半导体晶圆、玻璃基板、金属和聚合物在内的各种基板进行精确对准和键合。其智力优势在于将自上而下和自下而上的制造技术相结合，以开创基于生物传感器的器件和生物分子之间的新界面，这些界面可以针对特定应用进行定制，作为生物现象的传感器和致动器/控制器。生物分子的询问和对真实的细胞相互作用的理解需要3-D生物相容性结构、腔室和界面。从几个纳米到许多微米的长度尺度，细胞内和细胞间的机械转导信号在细胞功能的许多方面发挥着重要作用。拟议的精密晶圆对准器/键合器将成为UT阿灵顿的NanoFab的一部分，这是一个跨学科的资源，对大学内外的科学家开放。达拉斯-沃思堡大都市区拥有400多家高科技机构。作为用户设施，NanoFab将为这些研究人员提供24/7的晶圆对准器/焊接机，并为他们提供使用培训。将设立一个专门讨论3D集成的年度研讨会和在线讨论论坛。

"This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5)"The objective of this research is integration of optical, electrical and mechanical systems at nano- and micro-meter scale, thus enabling novel biomedical, energy harvesting and structural health monitoring devices and systems, otherwise not possible. The approach is to use a wafer aligner and bonder system for precision alignment and bonding of a diverse set of substrates including semiconductor wafers, glass substrates, metals and polymers.The intellectual merit lies in combining top-down and bottom-up fabrication techniques to pioneer new interfaces between semiconductor-based devices and biomolecules that can be tailored for specific applications, both as sensors and actuators / controllers of biological phenomena. The interrogation of bio-molecules and understanding of real cellular interactions require 3-D biocompatible structures, chambers and interfaces. Ranging in length scales from a few nanometers to many microns, inter and intra-cellular mechano-transduction signals play important roles in many aspects of cellular functions.The proposed Precision Wafer Aligner / Bonder will be part of NanoFab at UT Arlington, which is an interdisciplinary resource open to scientists within and outside of the University. The Dallas-Forth Worth metropolitan region is home to more than 400 high tech institutions. As a user facility, the NanoFab will make the wafer aligner / bonder available 24/7 to these researchers and provide them training for usage. An annual workshop as well as an online discussion forum dedicated to 3-D integration will be established.