EAGER: New Concept for Low Cost, High Throughput Inspection for Cracks in PV Manufacturing

EAGER：光伏制造中低成本、高通量裂纹检测的新概念

• 批准号: 1042187
• 负责人: Steven Danyluk
• 金额: $ 9万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-07-15 至 2012-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1042187&HistoricalAwards=false
• 关键词: EAGER; New; Concept; Low; Cost

The research objectives of this EArly-concept Grants for Exploratory Research award are to validate a new concept in surface inspection of thin crystalline silicon wafers of the type used in photovoltaic manufacturing. The new high risk ideas involve the use of multiple capacitive sensors situated above a moving assembly line of vibrating silicon wafers and the electrical output of the sensors to be used to create electrostatic images of the surface, revealing cracks. This method of detecting cracks can be done rapidly and to high precision. The approach will be to design and build an assembly line that uses ultrasonic transport methods, build a linear array of capacitive (Kelvin) probes under which the wafers will move, and develop methods to use the electrical signals to create electrostatic surface maps of the wafers.If successful, the benefits to society will be to make photovoltaics more acceptable and decrease the U.S. need for oil by providing a description of a silicon wafer inspection system that will be low cost and high throughput. This research will show how the cost of manufacturing photovoltaic devices using silicon wafers can be reduced, weeding out wafers that will fracture. The reliability of photovoltaic cells will increase, the module costs will decrease and the life of modules on commercial and residential rooftops will increase.

这个早期概念探索性研究赠款奖的研究目标是验证光伏制造中使用的薄晶体硅片表面检测的新概念。 新的高风险想法涉及使用位于振动硅晶片的移动装配线上方的多个电容传感器，以及用于创建表面静电图像的传感器的电输出，从而揭示裂纹。 这种检测裂纹的方法可以快速且高精度地完成。 该方法将设计和建造一条使用超声波运输方法的装配线，建造一个电容（开尔文）探针的线性阵列，晶片将在该阵列下移动，并开发使用电信号创建晶片静电表面图的方法。如果成功，对社会的好处将是通过提供一种硅晶片检测系统的描述，将是低成本和高吞吐量。 这项研究将展示如何降低使用硅片制造光伏器件的成本，淘汰会断裂的硅片。 光伏电池的可靠性将提高，组件成本将降低，商业和住宅屋顶组件的寿命将增加。