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U.S.-Korea Joint Seminar on Tribology, Seoul, Korea, October 24-29, 1995

U.S.-Korea Joint Seminar on Tribology, Seoul, Korea, October 24-29, 1995
美韩摩擦学联合研讨会,韩国首尔,1995 年 10 月 24-29 日
批准号:
9512849
负责人:
Steven Danyluk
金额:
$5.06万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1995
资助国家:
美国
项目状态:
已结题
起止时间:
1995-08-01 至 1996-07-31

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中文摘要
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英文摘要
9512849 Danyluk This award provides funds to permit Dr. Steven S. Danyluk, Department of Mechanical Engineering, Georgia Institute of Technology, to conduct with Dr. Soo Wohn Lee, Department of Materials Science and Engineering, Sun Moon University, Choongnam, Korea, a U.S.-Korea Joint Seminar on Tribology. This joint seminar will be held in Seoul, Korea, October 24-28, 1995. The participation of ten U.S. scientists/engineers will be supported under this award. The joint seminar will address several topics of current concern in the field of tribology, including wear modeling, lubricants, micro/nanotribology, surface polishing, and subsurface damage generation. In addition to formal seminar sessions, the U.S. delegation plans to learn about and evaluate the status of tribology research conducted in Korea through discussions on research results at the seminar and through site visits to evaluate tribology research capabilities in Korea. The U.S. participants will return to the U.S. by way of Japan where they will participate in the International Tribology Conference, Yokohama, from October 30 to November 2, 1995. The field of tribology is of great importance in manufacturing processes and in maintenance of machinery. The PI and his Korean collaborator are well qualified to organize and conduct such a joint seminar, as both are well known scholars in the related field of research. This project is relevant to the objectives of the U.S.-Korea Cooperative Science Program which seeks to increase the level of cooperation between U.S. and Korean scientists and engineers through the exchange of scientific information, ideas, skills, and techniques and through collaboration on problems of mutual interest and benefit. Korean participation is supported by the Korea Science and Engineering Foundation (KOSEF). ***
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