SHF: Small: Device-Circuit-Architecture Co-Design for Reconfigurable Computing at the Extreme
SHF: Small: Device-Circuit-Architecture Co-Design for Reconfigurable Computing at the Extreme
批准号:
1116102
负责人:
Swarup Bhunia
金额:
$40.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2011
资助国家:
美国
项目状态:
已结题
起止时间:
2011-09-01 至 2015-08-31
中文摘要
该项目的目标是探索在极端环境下的低功耗可重构计算技术,即在250°C的温度和高辐射(1-30 Mrad)下,传统电子设备无法可靠地工作。该项目寻求通过器件-电路-架构协同设计方法开发计算平台。该平台采用多晶SiC纳米机电系统(NEMS)开关,可实现纳米级尺寸,在极端条件下具有卓越的机械和化学稳定性,几乎为零泄漏。本课题研究了一种新型的多层悬臂梁开关结构,实现了高密度、鲁棒性强的可重构构件。将探讨与SiC结场效应晶体管(JFET)的可能杂交,以解决驱动能力有限的级联机械逻辑块的问题。该项目还研究了一种新的计算模型和架构,以适应故障并实现低互连开销。考虑到缺乏NEMS开关和电路的仿真模型,将开发合适的电路兼容模型。构建模块在高温下的操作将通过模拟以及测试芯片的制造和测量来验证。所提出的低功耗可重构硬件设计方法可以为汽车和工业应用、空间、航空电子、内燃机和智能推进系统等多个应用领域的极端环境计算提供支持技术。它可以提供比最先进的基于SiC晶体管的电子产品低一个数量级的功率和面积。该仿真模型可为纳米机械开关的分析提供有价值的研究工具。这项研究将通过开发一门新的本科课程、跨学科高级项目和一个恶劣环境电子产品的互联网小组,将教育和培训结合起来。
英文摘要
The objective of this project is to explore technology for low-power reconfigurable computing at extreme environment, i.e. at a temperature 250°C and at high radiation (1-30 Mrad), where conventional electronics fail to work reliably. The project seeks to develop the computing platform through a device-circuit-architecture co-design approach. The platform uses polycrystalline SiC nanoelectromechanical system (NEMS) switches to achieve nanoscale dimension, superior mechanical and chemical stability at extreme conditions and virtually zero leakage. The project studies a novel switch structure with multi-layer cantilever beams to realize the reconfigurable building blocks with high density and robustness. Possible hybridization with SiC junction field effect transistor (JFET) will be explored to address the issue of cascading mechanical logic blocks with limited driving capability. The project also investigates a novel computational model and architecture to adapt to failures and to achieve low interconnect overhead. Considering the lack of simulation models for NEMS switches and circuits, it will develop appropriate circuit-compatible models. Operation of the building blocks at high temperature will be validated through simulation as well as fabrication and measurements of test chips. The proposed low-power reconfigurable hardware design approach can provide enabling technology for extreme-environment computing in number of application areas including automotive and industrial applications, space, avionics, combustion engine, and intelligent propulsion systems. It can provide an order of magnitude lower power and area than state-of-the-art SiC transistor based electronics. The simulation models can be valuable research tool for analysis of nanoscale mechanical switches. The research will integrate education and training through development of a new undergraduate course, interdisciplinary senior projects, and an internet group on harsh environment electronics.
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