SHF:Medium:Collaborative Reseach: Electrical-thermal Co-Design of Microfluidically-Cooled 3D IC's

SHF：媒介：协作研究：微流控 3D IC 的电热协同设计

• 批准号: 1302375
• 负责人: Ankur Srivastava
• 金额: $ 46.47万
• 依托单位: University of Maryland, College Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-09-15 至 2018-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1302375&HistoricalAwards=false
• 关键词: SHF; Medium; Collaborative; Reseach; Electrical

The technical goal of this project is to develop and refine the micro-fluidic 3D IC cooling technology. While 3D integration offers significant potential for improving the performance, energy efficiency and functionality of electronic systems, the problem of heat removal is significantly exacerbated. Conventional air cooling alone would be incapable of addressing the future 3D IC heat removal requirements. In this project, the PIs are investigating use of aggressive micro-fluidic cooling technology for cooling 3D ICs. The team comprises researchers from University of Maryland and Georgia Institute of Technology. The Georgia Tech team would bring forth significant expertise in fabrication and modeling of 3D ICs with interlayer micro-fluidic cooling. The Maryland team will bring forth expertise in VLSI design methodologies. The primary focus of this proposal is: development of techniques and tools for co-design of micro-fluidic embedded cooling and electrical aspects of 3D ICs.This proposal would directly support several PhD students in different disciplines. Because of the cross disciplinary nature of this proposal, these students would need to learn diverse set of topics pertaining to fluidics, chip design and thermal management. Undergraduates will also be involved through various programs at Georgia Tech and Maryland. The outcomes of this research will be published in respectable venues in both electrical/computer engineering and mechanical engineering. The tools, models and experimental data will also be made available on the web. The PIs plan to organize tutorials at various conferences and educational forums. Special emphasis will be givenon minority involvement via collaboration with local HBCUs.

该项目的技术目标是开发和完善微流体3D IC冷却技术。虽然3D集成为提高电子系统的性能、能效和功能提供了巨大的潜力，但散热问题却大大加剧。传统的空气冷却单独将无法解决未来的3D IC散热要求。在这个项目中，PI正在研究使用积极的微流体冷却技术来冷却3D IC。该团队由来自马里兰州大学和格鲁吉亚理工学院的研究人员组成。格鲁吉亚技术团队将在利用层间微流体冷却的3D IC的制造和建模方面带来重要的专业知识。马里兰州团队将带来超大规模集成电路设计方法的专业知识。该提案的主要重点是：开发用于3D IC的微流体嵌入式冷却和电气方面的协同设计的技术和工具。该提案将直接支持不同学科的多名博士生。由于该提案的跨学科性质，这些学生需要学习与流体学，芯片设计和热管理有关的各种主题。本科生也将通过在格鲁吉亚理工学院和马里兰州的各种计划参与。这项研究的成果将在电气/计算机工程和机械工程领域的知名场所发表。这些工具、模型和实验数据也将在网上提供。PI计划在各种会议和教育论坛上组织教程。将特别强调通过与当地HBCUs的合作，让少数民族参与。

项目成果

Value-driven Synthesis for Neural Network ASICs

• DOI: 10.1145/3218603.3218634
• 发表时间: 2018-07
• 期刊: Proceedings of the International Symposium on Low Power Electronics and Design
• 作者: Zhiyuan Yang;Ankur Srivastava-