Workshop: Bugs and Defects in Electronic Systems: The Next Frontier

研讨会：电子系统中的错误和缺陷：下一个前沿

• 批准号: 1341270
• 负责人: Subhasish Mitra
• 金额: $ 2.25万
• 依托单位: Stanford University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-08-01 至 2014-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1341270&HistoricalAwards=false
• 关键词: Workshop; Bugs; Defects; Electronic; Systems

This Dagstuhl workshop is to bring together scientists from the research areas of Design Verification, Formal Methods, High-level Design, Manufacturing Testing, Robust System Design, and related disciplines in the context of integrated circuit manufacturing. The objective is to discuss major upcoming obstacles in the design, verification, and testing of robust systems and their potential solutions. Existing pre-silicon verification is insufficiently scalable, and today's manufacturing test methodologies may not be adequate in screening marginal and reliability failures. Bugs and defects that impact system correctness and/or security must be detected, localized, and corrected in the system environment, during post-silicon validation, or during system operation in the field. New methodologies, that are radical departures from today's practice and require multi-disciplinary effort spanning traditionally distinct research areas are to be discussed.The outcome of this workshop is expected to influence US semiconductor industry by making connections between the academic and industrial researchers. The industry experts present at the workshop will also be instrumental in the benchmarking efforts critical to the research in the field. The workshop will also use the technical topic as a means to assess the value of joint collaborations between the relevant US and German scientific communities and explore various collaboration mechanisms that can be supported by the respective funding agencies. To this end, the workshop is co-sponsored by the German Science Foundation (DFG) as well.

这个Dagstuhl研讨会将汇集来自设计验证，形式化方法，高级设计，制造测试，鲁棒系统设计和集成电路制造相关学科研究领域的科学家。其目的是讨论在设计，验证和测试的强大的系统和他们的潜在解决方案的主要即将到来的障碍。现有的预硅验证是不够的可扩展性，今天的制造测试方法可能不足以筛选边际和可靠性故障。影响系统正确性和/或安全性的错误和缺陷必须在系统环境中、硅后验证期间或现场系统操作期间检测、定位和纠正。新的方法，是从今天的实践，需要跨传统的不同研究领域的多学科的努力彻底背离将被讨论。本次研讨会的结果预计将影响美国半导体行业之间的学术和工业研究人员的连接。出席研讨会的行业专家也将在对该领域研究至关重要的基准制定工作中发挥作用。研讨会还将利用技术专题评估美国和德国相关科学界之间联合合作的价值，并探索各自资助机构可以支持的各种合作机制。为此，该研讨会也由德国科学基金会（DFG）共同赞助。