Workshop: Bugs and Defects in Electronic Systems: The Next Frontier
Workshop: Bugs and Defects in Electronic Systems: The Next Frontier
批准号:
1341270
负责人:
Subhasish Mitra
金额:
$2.25万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2013
资助国家:
美国
项目状态:
已结题
起止时间:
2013-08-01 至 2014-07-31
中文摘要
本次研讨会将汇集来自集成电路制造背景下设计验证、形式化方法、高级设计、制造测试、鲁棒系统设计和相关学科研究领域的科学家。目的是讨论在健壮系统的设计、验证和测试中即将出现的主要障碍及其潜在的解决方案。现有的预硅验证没有足够的可扩展性,今天的制造测试方法可能不足以筛选边际和可靠性故障。影响系统正确性和/或安全性的错误和缺陷必须在系统环境中、在硅后验证期间或在现场的系统操作期间进行检测、定位和纠正。新的方法,是彻底背离今天的做法,需要多学科的努力跨越传统上不同的研究领域进行讨论。预计此次研讨会的成果将通过建立学术界和工业界研究人员之间的联系,对美国半导体行业产生影响。出席研讨会的行业专家也将在对该领域的研究至关重要的基准工作中发挥重要作用。该研讨会还将利用技术主题作为一种手段,评估美国和德国相关科学界之间联合合作的价值,并探索可由各自资助机构支持的各种合作机制。为此,该研讨会也是由德国科学基金会(DFG)共同主办的。
英文摘要
This Dagstuhl workshop is to bring together scientists from the research areas of Design Verification, Formal Methods, High-level Design, Manufacturing Testing, Robust System Design, and related disciplines in the context of integrated circuit manufacturing. The objective is to discuss major upcoming obstacles in the design, verification, and testing of robust systems and their potential solutions. Existing pre-silicon verification is insufficiently scalable, and today's manufacturing test methodologies may not be adequate in screening marginal and reliability failures. Bugs and defects that impact system correctness and/or security must be detected, localized, and corrected in the system environment, during post-silicon validation, or during system operation in the field. New methodologies, that are radical departures from today's practice and require multi-disciplinary effort spanning traditionally distinct research areas are to be discussed.The outcome of this workshop is expected to influence US semiconductor industry by making connections between the academic and industrial researchers. The industry experts present at the workshop will also be instrumental in the benchmarking efforts critical to the research in the field. The workshop will also use the technical topic as a means to assess the value of joint collaborations between the relevant US and German scientific communities and explore various collaboration mechanisms that can be supported by the respective funding agencies. To this end, the workshop is co-sponsored by the German Science Foundation (DFG) as well.
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会议论文
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