Workshop: Bugs and Defects in Electronic Systems: The Next Frontier

本次Dagstuhl研讨会旨在汇聚来自集成电路制造领域的设计验证、形式化方法、高级设计、制造测试、稳健系统设计以及相关学科研究领域的科学家。目标是讨论在设计、验证和测试健壮系统及其潜在解决方案方面即将遇到的主要障碍。现有的预硅验证不具有足够的可伸缩性，并且今天的制造测试方法可能不足以筛选边缘和可靠性故障。影响系统正确性和/或安全性的错误和缺陷必须在系统环境中、在硅片后验证期间或在现场系统运行期间检测、定位和纠正。将讨论新的方法，这些方法与当今的实践截然不同，需要跨传统不同研究领域的多学科努力。这次研讨会的结果预计将通过将学术研究人员和工业研究人员联系起来而影响美国半导体行业。出席研讨会的行业专家还将在对该领域研究至关重要的基准工作中发挥重要作用。研讨会还将利用这一技术主题作为评估美国和德国相关科学界之间联合合作的价值的一种手段，并探索可以得到各自资助机构支持的各种合作机制。为此，研讨会也由德国科学基金会(DFG)共同赞助。

This Dagstuhl workshop is to bring together scientists from the research areas of Design Verification, Formal Methods, High-level Design, Manufacturing Testing, Robust System Design, and related disciplines in the context of integrated circuit manufacturing. The objective is to discuss major upcoming obstacles in the design, verification, and testing of robust systems and their potential solutions. Existing pre-silicon verification is insufficiently scalable, and today's manufacturing test methodologies may not be adequate in screening marginal and reliability failures. Bugs and defects that impact system correctness and/or security must be detected, localized, and corrected in the system environment, during post-silicon validation, or during system operation in the field. New methodologies, that are radical departures from today's practice and require multi-disciplinary effort spanning traditionally distinct research areas are to be discussed.The outcome of this workshop is expected to influence US semiconductor industry by making connections between the academic and industrial researchers. The industry experts present at the workshop will also be instrumental in the benchmarking efforts critical to the research in the field. The workshop will also use the technical topic as a means to assess the value of joint collaborations between the relevant US and German scientific communities and explore various collaboration mechanisms that can be supported by the respective funding agencies. To this end, the workshop is co-sponsored by the German Science Foundation (DFG) as well.