I-Corps: Universal Biaxial Compressive Strain Measurement System

为了提高器件性能，大多数材料通常处于单轴和双轴应力状态。这些类型的载荷下的材料必须得到很好的控制，以达到预期的收益。目前，单轴压缩被认为是电子材料中最容易获得应变的方法，并被广泛应用于制造先进的半导体芯片。然而，与双轴应变相比，单轴应变在调整材料性能方面的有效性有限，因此限制了其未来的发展前景。双轴应力-应变试验通常很难进行。其中一些挑战包括：样品尺寸小；衬底的抓握完整性；以及衬底内的变形均匀度。这项工作旨在开发一种原型压缩双轴应变室，它可以满足需要可靠的双轴应变测量系统的客户，而不受市场上现有系统中存在的上述问题的限制。拟议的项目旨在提高半导体行业使用的电子材料的性能。尤其是那些正在寻求提高设备性能，并将目光投向单轴后解决方案以提高效率的人。材料可分为三种：金属、半导体和绝缘体。虽然，预计这些材料将保持其电学性能，但当施加压缩应变时，材料的导电性能可以调整。这种电子材料性能随应变的变化被称为应变工程。I-Corps团队提出，使用双向应变系统，不仅可以提高硅基电子产品的器件性能，还可以提高基于石墨烯和其他二维材料的下一代纳米电子产品的性能。在这个项目中，该团队将使用双轴测试装置来测量高应变率(10%)的多层二硫化钼和其他2D材料的应变和压力相关的电子、振动、光学和结构特性。

To increase device performance, most materials are often subjected to uniaxial and biaxial states of stress. The material under these types of loadings must be well controlled to achieve the desired gain. Currently, uniaxial compression is considered the easiest method for achieving strain in electronic materials, and widely used in manufacturing advanced semiconductor chips. However, uniaxial strain is limited in its effectiveness in tailoring material properties compared to biaxial strain, hence, its future prospects are restricted. Biaxial stress-strain tests are generally difficult to perform. Some of the challenges include: small sample sizes; grip integrity to the substrate; and deformation homogeneity within the substrate. This effort aims to develop a prototype compressive biaxial strain chamber which can cater to customers who need a reliable biaxial strain measurement system without the limitations of the aforementioned issues that exist in current systems in the market. The proposed project is aimed at advancing the performance of electronic materials used in the semiconductor industry. In particular, those who are seeking to increase device performance, and are looking beyond post-uniaxial solutions for increased efficiency. There are three phases that materials can be categorized into are metals, semiconductors, and insulators. Although, it is expected that these materials would maintain their electrical properties, when compressive strain is applied, the material's conductive properties can be tuned. This modulation of the electronic material properties with strain is known as strain engineering. This I-Corps team proposes that using the biaxial strain system, one can increase device performance not only for silicon based electronics, but also for next-generation nanoscale electronics based on graphene and other two-dimensional materials. In this project, the team will use the biaxial testing setup to measure the strain and pressure-dependent electronic, vibrational, optical and structural properties of multilayered molybdenum disulphide and other 2D materials up to high strain rates (10%).