High Performance Machining of Brittle Materials by Controlled Crack Propagation

通过控制裂纹扩展对脆性材料进行高性能加工

基本信息

  • 批准号:
    1537846
  • 负责人:
  • 金额:
    $ 29.92万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2015
  • 资助国家:
    美国
  • 起止时间:
    2015-09-01 至 2019-08-31
  • 项目状态:
    已结题

项目摘要

Precision parts made from a wide variety of brittle materials have broad applications in healthcare, biomedical, energy, photonics, and automotive industries. A big challenge with high speed machining of brittle materials is to achieve high surface quality. A major problem encountered in machining these materials is random crack propagation into the workpiece, resulting in surface/subsurface cracks and thus strength degradation of the machined parts. Existing techniques rely on polishing, a very slow and costly process, to achieve high surface quality. This award supports fundamental research to provide needed knowledge for the development of a novel machining process to overcome this main limitation. The new process will enable high efficiency machining of brittle materials without compromising part quality. The results from this research will generate economic and societal benefits for the U.S. This research involves several disciplines including manufacturing, laser and optics, fracture mechanics, and biomaterials. The multi-disciplinary nature will help enlist underrepresented groups to conduct research and thus positively impact engineering education. The objectives of this research are twofold. First, the relationship between femtosecond laser parameters (e.g., pulse energy, spot size, number of pulses) and microcrack geometry (e.g., crack length, crack orientation, crack gap) will be established. This objective will be achieved by performing laser micromachining experiments to generate seed cracks inside the workpiece material. Knowledge gained from this research will be used to inject seed cracks into the cutting zone of a workpiece. Second, the relationship between process parameters (e.g., machining conditions, tool geometry, crack geometry) and part quality (e.g., surface/subsurface damage, surface roughness) will be determined. This objective will be accomplished by conducting machining experiments, assisted by numerical modeling, and assessing part quality using surface profilometery, optical microscopy, scanning electron microscopy, and three-dimensional optical profilometry. This basic research will advance the knowledge base in machining brittle materials and enable new process developments based on controlled crack propagation.
由各种脆性材料制成的精密零件在医疗保健、生物医学、能源、光电子和汽车工业中有着广泛的应用。脆性材料高速加工的一大挑战是如何获得高表面质量。在加工这些材料时遇到的一个主要问题是随机裂纹扩展到工件中,导致表面/次表面裂纹,从而导致被加工零件的强度下降。现有的技术依赖于抛光,这是一个非常缓慢和昂贵的过程,以达到高表面质量。该奖项支持基础研究,为开发新的加工工艺提供所需的知识,以克服这一主要限制。新工艺将使脆性材料的高效加工不影响零件质量。这项研究的结果将为美国带来经济和社会效益。这项研究涉及多个学科,包括制造、激光和光学、断裂力学和生物材料。多学科性质将有助于招募代表性不足的群体进行研究,从而对工程教育产生积极影响。这项研究的目的是双重的。首先,建立飞秒激光参数(如脉冲能量、光斑大小、脉冲数)与微裂纹几何形状(如裂纹长度、裂纹取向、裂纹间隙)之间的关系。这一目标将通过执行激光微加工实验来实现,以在工件材料内部产生种子裂纹。从这项研究中获得的知识将用于将种子裂纹注入工件的切削区。其次,确定工艺参数(如加工条件、刀具几何形状、裂纹几何形状)与零件质量(如表面/亚表面损伤、表面粗糙度)之间的关系。这一目标将通过进行机械加工实验,辅以数值模拟,并使用表面轮廓测量法、光学显微镜、扫描电子显微镜和三维光学轮廓测量法评估零件质量来实现。这一基础研究将提高脆性材料加工的知识库,并促进基于受控裂纹扩展的新工艺的发展。

项目成果

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Shuting Lei其他文献

3D numerical investigation of thermally assisted high efficiency ductile machining of nanocrystalline hydroxyapatite
  • DOI:
    10.1016/j.jmapro.2013.06.007
  • 发表时间:
    2013-10-01
  • 期刊:
  • 影响因子:
  • 作者:
    Jianfeng Ma;Nathan Pelate;Shuting Lei
  • 通讯作者:
    Shuting Lei
A two-step strategy for production of spherical non-aggregated multi-component particles by suspension-fed spray flame
通过悬浮喷射火焰生产球形非聚集多组分颗粒的两步策略
  • DOI:
    10.1016/j.proci.2024.105350
  • 发表时间:
    2024
  • 期刊:
  • 影响因子:
    3.4
  • 作者:
    Shuting Lei;Yiyang Zhang;Zhu Fang;Tianyi Wu;Xing Jin;Shuiqing Li
  • 通讯作者:
    Shuiqing Li
Direct observation and quantification of nanosecond laser induced amorphization inside silicon
硅内部纳秒激光诱导非晶化的直接观察和定量
  • DOI:
    10.2351/7.0001305
  • 发表时间:
    2024
  • 期刊:
  • 影响因子:
    2.1
  • 作者:
    Xinya Wang;Lanh Trinh;Xiaoming Yu;Matthew J. Berg;Sajed Hosseini;Brice Lacroix;Pingping Chen;Ruqi Chen;Bai Cui;Shuting Lei
  • 通讯作者:
    Shuting Lei
Spray flame synthesis of the NASICON-structure Nasub3/subZrsub2/subSisub2/subPOsub12/sub solid electrolyte nanoparticles for solid-state Nasup+/sup batteries
喷雾火焰合成NASICON结构NASUB3/subzrsub2/subsisub2/subposub12/subposub12/sub solid电解质纳米颗粒,用于固态NASUP+/SUP电池
  • DOI:
    10.1016/j.proci.2024.105347
  • 发表时间:
    2024-01-01
  • 期刊:
  • 影响因子:
    5.200
  • 作者:
    Tianyi Wu;Yiyang Zhang;Zhu Fang;Shuting Lei;Xing Jin;Shuiqing Li
  • 通讯作者:
    Shuiqing Li
Experimental Investigation and Mechanism Analysis of Tungsten Disulfide Soft Coated Micro-Nano Textured Self-Lubricating Dry Cutting Tools
二硫化钨软涂层微纳织构自润滑干切削刀具实验研究及机理分析

Shuting Lei的其他文献

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{{ truncateString('Shuting Lei', 18)}}的其他基金

Collaborative Research: All-Optical Fabrication of Low-Loss, High-Index-Contrast, Silicon-in-Silicon Waveguides
合作研究:低损耗、高折射率对比度、硅中硅波导的全光学制造
  • 批准号:
    2128962
  • 财政年份:
    2021
  • 资助金额:
    $ 29.92万
  • 项目类别:
    Standard Grant
High Performance Laser Scribing of Advanced Thin Film Materials
先进薄膜材料的高性能激光划片
  • 批准号:
    1903740
  • 财政年份:
    2019
  • 资助金额:
    $ 29.92万
  • 项目类别:
    Standard Grant
Defect Free and Robust Microstructuring Using Femtosecond Axicon-lens-focused Beam (FAB) with Application Focus in Thin Film Solar Cell Manufacturing
使用飞秒轴锥透镜聚焦光束 (FAB) 实现无缺陷且稳健的微结构,重点应用于薄膜太阳能电池制造
  • 批准号:
    1131627
  • 财政年份:
    2011
  • 资助金额:
    $ 29.92万
  • 项目类别:
    Standard Grant
Collaborative Research: Mathematical Modeling and Experimental Study of Femtosecond Laser Machining of High Aspect Ratio Microstructures
合作研究:飞秒激光加工高深宽比微结构的数学建模和实验研究
  • 批准号:
    0826015
  • 财政年份:
    2008
  • 资助金额:
    $ 29.92万
  • 项目类别:
    Standard Grant
CAREER: Design and Development of Novel Responsive Cutting Tools for Laser-Assisted Machining and Diagnosis of Structural Ceramics: A Research Integrated Education Career Landscape
职业:用于结构陶瓷激光辅助加工和诊断的新型响应切削工具的设计和开发:研究集成教育职业前景
  • 批准号:
    0134579
  • 财政年份:
    2002
  • 资助金额:
    $ 29.92万
  • 项目类别:
    Standard Grant

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