PFI-TT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices

该创新-技术转化合作伙伴关系（PFI-TT）项目的更广泛影响/商业潜力是为更高效和强大的计算提供更好的冷却。 该技术开发和商业化项目将研究直接在硅上3D打印金属鳍片的潜在好处，与标准现有技术相比，可以实现10倍的冷却改进。 该技术可以实现更快、更高功率的计算，特别是对于进行高需求流程（例如训练人工智能系统）的超级计算机。研究的目的是证明优化的印刷工艺，机械粘接/可靠性，和散热器设计的性能优势。 教育目标是通过行业指导和参与宾厄姆顿大学的XCEED和区域I-Corps计划，培养博士后和学生团队的创业精神和领导力。 参与将通过在研究中纳入LSAMP暑期学生扩大，并有学生和博士后团队领导一个研讨会，解释他们的创新和创业探索在我们的校园LSAMP的研讨会系列。 拟议项目的重点是将在硅衬底上激光打印熔融金属合金Sn 3Ag 4 Ti的研究转化为最小可行产品，以向潜在的开发和战略合作伙伴进行演示。该工艺包括在硅上沉积一层薄的Sn 3Ag 4 Ti粉末层，并将需要冷却翅片的区域暴露于激光加热。随后的铜层被沉积到该层上，以使用选择性激光熔化形成高纵横比的散热片。快速激光加热在界面处形成薄的硅化物和金属间化合物膜。将研究使用选择性激光熔化的整个鳍片组件的制造，特别是如何将高热导率的铜金属存款到Sn 3Ag 4 Ti层上。 我们还将测量器件的界面机械性能和热循环性能，这对电子封装的可靠性至关重要。在高的热通量，预计在下一代封装的散热器的设计，将使用神经网络技术进行优化。我们的研究将通过改进加工方法，展示长期的机械可靠性，优化印刷散热器以在高热流下实现最小热阻，从而解决关键的转化挑战。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to enable better cooling for more efficient and powerful computing. This technology development and commercialization project will investigate the potential benefit of 3D printing metal fins directly onto silicon to enable a 10X improvement in cooling compared to standard existing technologies. This technology may enable faster and higher power computing, especially for supercomputers conducting high demand processes, such as training artificial intelligence systems. The research objective is to demonstrate a performance benefit resulting from the optimization of the printing process, mechanical bonding/reliability, and the heat sink design. The education objective is to train a postdoctoral and student team in the essentials of entrepreneurship and leadership through industry mentorship and participation in Binghamton University’s XCEED and regional I-Corps program. Participation will be broadened by inclusion of an LSAMP summer student in the research, and having the student and postdoc team lead a seminar explaining their innovation and entrepreneurial quest at our campus LSAMP’s seminar series. The proposed project focuses on translating research on laser printing a molten metal alloy, called Sn3Ag4Ti, on a silicon substrate into a minimum viable product for demonstration to potential development and strategic partners. The process includes depositing a thin powder layer of Sn3Ag4Ti onto silicon and exposing the areas where cooling fins are desired to laser heating. Subsequent layers of copper are then deposited onto this layer to form high-aspect ratio cooling fins using selective laser melting. The rapid laser heating forms thin silicide and intermetallic films at the interface. The manufacture of the entire fin assembly using selective laser melting will be researched, specifically how to deposit high thermal conductivity copper metal onto the Sn3Ag4Ti layer. We will also measure the interfacial mechanical properties and thermal cyclability of the device, which are critical to electronic packaging reliability. The design of the heat sink at high heat fluxes, expected in the next generation of packages, will be optimized using neural network techniques. Our research will solve key translational challenges by refining the processing method, demonstrating long-term mechanical reliability, and optimizing the printed heat sink for minimal thermal resistance at high heat fluxes.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.