PFI-TT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices

PFI-TT：通过激光增材制造除热装置的 3D 打印增强电子冷却

• 批准号: 1941181
• 负责人: Scott Schiffres
• 金额: $ 25万
• 依托单位: SUNY at Binghamton
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2020
• 资助国家: 美国
• 起止时间: 2020-05-01 至 2024-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1941181&HistoricalAwards=false
• 关键词: PFI; TT; Enhanced; Electronic; Cooling

The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to enable better cooling for more efficient and powerful computing. This technology development and commercialization project will investigate the potential benefit of 3D printing metal fins directly onto silicon to enable a 10X improvement in cooling compared to standard existing technologies. This technology may enable faster and higher power computing, especially for supercomputers conducting high demand processes, such as training artificial intelligence systems. The research objective is to demonstrate a performance benefit resulting from the optimization of the printing process, mechanical bonding/reliability, and the heat sink design. The education objective is to train a postdoctoral and student team in the essentials of entrepreneurship and leadership through industry mentorship and participation in Binghamton University’s XCEED and regional I-Corps program. Participation will be broadened by inclusion of an LSAMP summer student in the research, and having the student and postdoc team lead a seminar explaining their innovation and entrepreneurial quest at our campus LSAMP’s seminar series. The proposed project focuses on translating research on laser printing a molten metal alloy, called Sn3Ag4Ti, on a silicon substrate into a minimum viable product for demonstration to potential development and strategic partners. The process includes depositing a thin powder layer of Sn3Ag4Ti onto silicon and exposing the areas where cooling fins are desired to laser heating. Subsequent layers of copper are then deposited onto this layer to form high-aspect ratio cooling fins using selective laser melting. The rapid laser heating forms thin silicide and intermetallic films at the interface. The manufacture of the entire fin assembly using selective laser melting will be researched, specifically how to deposit high thermal conductivity copper metal onto the Sn3Ag4Ti layer. We will also measure the interfacial mechanical properties and thermal cyclability of the device, which are critical to electronic packaging reliability. The design of the heat sink at high heat fluxes, expected in the next generation of packages, will be optimized using neural network techniques. Our research will solve key translational challenges by refining the processing method, demonstrating long-term mechanical reliability, and optimizing the printed heat sink for minimal thermal resistance at high heat fluxes.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该创新合作伙伴关系 - 技术转化 (PFI-TT) 项目更广泛的影响/商业潜力是实现更好的冷却，从而实现更高效、更强大的计算。 该技术开发和商业化项目将研究直接在硅上 3D 打印金属翅片的潜在优势，与标准现有技术相比，使冷却性能提高 10 倍。 这项技术可以实现更快、更高功率的计算，特别是对于执行高要求流程的超级计算机，例如训练人工智能系统。研究目标是展示印刷工艺、机械粘合/可靠性和散热器设计优化所带来的性能优势。 教育目标是通过行业指导和参与宾厄姆顿大学的 XCEED 和地区 I-Corps 项目，培训博士后和学生团队掌握创业和领导力的要素。 通过将 LSAMP 暑期学生纳入研究，并让学生和博士后团队在我们校园 LSAMP 研讨会系列中主持一场研讨会，解释他们的创新和创业追求，将扩大参与范围。 拟议项目的重点是将激光打印硅基板上的熔融金属合金（称为 Sn3Ag4Ti）的研究转化为最小可行产品，以向潜在开发和战略合作伙伴进行演示。该工艺包括在硅上沉积一层薄薄​​的 Sn3Ag4Ti 粉末层，并将需要冷却翅片的区域暴露在激光加热下。然后将后续的铜层沉积到该层上，以使用选择性激光熔化形成高深宽比的冷却翅片。快速激光加热在界面处形成薄硅化物和金属间化合物薄膜。将研究使用选择性激光熔化制造整个翅片组件，特别是如何将高导热铜金属沉积到 Sn3Ag4Ti 层上。 我们还将测量器件的界面机械性能和热循环性能，这对于电子封装的可靠性至关重要。预计下一代封装中的高热通量散热器设计将使用神经网络技术进行优化。我们的研究将通过改进加工方法、展示长期机械可靠性以及优化印刷散热器以在高热通量下实现最小热阻来解决关键的转化挑战。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

Direct Micro-Pin Jet Impingement Cooling for High Heat Flux Applications

适用于高热通量应用的直接微针喷射冲击冷却

• DOI: 10.23919/semi-therm50369.2020.9142864
• 发表时间: 2020
• 期刊: Modeling & Management Symposium (SEMI-THERM
• 作者: Radmard, Vahideh;Hadad, Yaser;Azizi, Arad;Rangarajan, Srikanth;Hoang, C. Hiep;Arvin, Charles;Sikka, Kamal;Schiffres, Scott N.;Sammakia, Bahgat
• 通讯作者: Sammakia, Bahgat

Process-dependent anisotropic thermal conductivity of laser powder bed fusion AlSi10Mg: impact of microstructure and aluminum-silicon interfaces

• DOI: 10.1108/rpj-09-2022-0290
• 发表时间: 2023-02-03
• 期刊: RAPID PROTOTYPING JOURNAL
• 影响因子: 3.9
• 作者: Azizi, Arad;Hejripour, Fatemeh;Schiffres, Scott N.
• 通讯作者: Schiffres, Scott N.

Two-phase Impingement Cooling using a Trapezoidal Groove Microchannel Heat Sink and Dielectric Coolant HFE 7000

使用梯形槽微通道散热器和介电冷却剂 HFE 7000 的两相冲击冷却

• DOI: 10.1109/itherm51669.2021.9503283
• 发表时间: 2021
• 期刊: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm
• 作者: Hoang, Cong Hiep;Rangarajan, Srikanth;Radmard, Vahideh;Fallahtafti, Najmeh;Tradat, Mohammad;Arvin, Charles;Schiffres, Scott;Sammakia, Bahgat
• 通讯作者: Sammakia, Bahgat