Collaborative Research: FuSe: GeSnO2 Alloys for Next-Generation Semiconductor Devices
合作研究:FuSe:用于下一代半导体器件的 GeSnO2 合金
基本信息
- 批准号:2328701
- 负责人:
- 金额:$ 118.14万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Continuing Grant
- 财政年份:2023
- 资助国家:美国
- 起止时间:2023-10-01 至 2026-09-30
- 项目状态:未结题
- 来源:
- 关键词:
项目摘要
Non-technical Description:This project brings together a team of scientists in physics, chemistry, materials science, and electrical engineering at the University of Michigan and the University of Minnesota to co-design electronic materials and devices based on oxides of the elements tin and germanium. It answers fundamental scientific questions to understand how these materials can be grown with sufficiently high quality and how their electrical conductivity can be controlled by modifications to their composition. The project has the potential to transform the development of fast, compact, and energy-efficient electronic devices manufactured with non-toxic elements, to catalyze applications such as electric vehicles and smart electricity grids, and to stimulate economic growth in the US. The principal investigators promote diversity and expand graduate education opportunities through initiatives such as developing curricula, mentoring undergraduate and PhD students, hosting summer schools, and collaborating with programs that support undergraduate research.Technical Description:This project supports research activities on the co-design of ultra-wide-band-gap semiconductor materials and electronic devices based on alloys of germanium dioxide with tin dioxide in the rutile structure. The research activities combine theory, thin-film growth, structural and electrical characterization, and device fabrication, and focus on (1) the development of high-quality thin films, (2) the demonstration of n-type and p-type doping, (3) the development of high-quality electrical contacts, (4) the understanding of low- and high- field electrical transport, and (5) the fabrication of prototype power devices. The research aims to advance the science and engineering of oxide semiconductor materials in order to co-design prototype devices and accelerate the manufacturing of energy-efficient electronics.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
非技术描述:该项目汇集了密歇根大学和明尼苏达大学的物理,化学,材料科学和电气工程科学家团队,共同设计基于锡和锗元素氧化物的电子材料和设备。它回答了基本的科学问题,以了解这些材料如何以足够高的质量生长,以及如何通过修改其成分来控制其电导率。该项目有可能改变使用无毒元素制造的快速,紧凑和节能电子设备的发展,促进电动汽车和智能电网等应用,并刺激美国的经济增长。主要研究者通过开发课程、指导本科生和博士生、举办暑期学校、与支持本科生研究的项目合作等举措,促进多样性,扩大研究生教育机会。技术说明:本项目支持基于金红石结构的二氧化锗和二氧化锡合金的超宽带隙半导体材料和电子器件的共同设计研究活动。研究活动结合了联合收割机理论、薄膜生长、结构和电学特性以及器件制造,并集中在(1)高质量薄膜的开发,(2)n型和p型掺杂的演示,(3)高质量电接触的开发,(4)低场和高场电输运的理解,(5)功率器件原型的制作。该研究旨在推进氧化物半导体材料的科学和工程,以共同设计原型器件并加速节能电子产品的制造。该奖项反映了NSF的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Emmanouil Kioupakis其他文献
Protecting the properties of monolayer MoS2 on silicon based substrates with an atomically thin buffer
用原子级薄缓冲层保护硅基衬底上单层 MoS2 的性能
- DOI:
10.1038/srep20890 - 发表时间:
2016-02-12 - 期刊:
- 影响因子:3.900
- 作者:
Michael K. L. Man;Skylar Deckoff-Jones;Andrew Winchester;Guangsha Shi;Gautam Gupta;Aditya D. Mohite;Swastik Kar;Emmanouil Kioupakis;Saikat Talapatra;Keshav M. Dani - 通讯作者:
Keshav M. Dani
Emmanouil Kioupakis的其他文献
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{{ truncateString('Emmanouil Kioupakis', 18)}}的其他基金
Collaborative Research: FuSe: Heterogeneous Integration of III-Nitride and Boron Arsenide for Enhanced Thermal and Electronic Performance
合作研究:FuSe:III族氮化物和砷化硼的异质集成以增强热和电子性能
- 批准号:
2329109 - 财政年份:2023
- 资助金额:
$ 118.14万 - 项目类别:
Standard Grant
ECCS-CDS&E: Predictive modeling of atomically thin multifunctional semiconductors
ECCS-CDS
- 批准号:
1607796 - 财政年份:2016
- 资助金额:
$ 118.14万 - 项目类别:
Standard Grant
DMREF: Collaborative Research: Extreme Bandgap Semiconductors
DMREF:协作研究:极限带隙半导体
- 批准号:
1534221 - 财政年份:2015
- 资助金额:
$ 118.14万 - 项目类别:
Standard Grant
CAREER: First-principles calculations of quantum processes in bulk and nanostructured semiconductors
职业:块体和纳米结构半导体中量子过程的第一原理计算
- 批准号:
1254314 - 财政年份:2013
- 资助金额:
$ 118.14万 - 项目类别:
Continuing Grant
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相似海外基金
Collaborative Research: FuSe: R3AP: Retunable, Reconfigurable, Racetrack-Memory Acceleration Platform
合作研究:FuSe:R3AP:可重调、可重新配置、赛道内存加速平台
- 批准号:
2328975 - 财政年份:2024
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$ 118.14万 - 项目类别:
Continuing Grant
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合作研究:FuSe:R3AP:可重调、可重新配置、赛道内存加速平台
- 批准号:
2328972 - 财政年份:2024
- 资助金额:
$ 118.14万 - 项目类别:
Continuing Grant
Collaborative Research: FuSe: R3AP: Retunable, Reconfigurable, Racetrack-Memory Acceleration Platform
合作研究:FuSe:R3AP:可重调、可重新配置、赛道内存加速平台
- 批准号:
2328974 - 财政年份:2024
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$ 118.14万 - 项目类别:
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2328741 - 财政年份:2023
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$ 118.14万 - 项目类别:
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2328906 - 财政年份:2023
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$ 118.14万 - 项目类别:
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- 批准号:
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