Study on a new three-dimensional laser micro-processing method using the difference in the permeation characteristic
Study on a new three-dimensional laser micro-processing method using the difference in the permeation characteristic
批准号:
11450055
负责人:
IKENO Junichi
金额:
$7.81万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B).
财政年份:
1999
资助国家:
日本
项目状态:
已结题
起止时间:
1999 至 2000
中文摘要
近年来,制造业追求产品附加值、低成本、高产品组合和适当的重复性生产以及与地球环境的和谐。激光加工不同于传统的机械和化学加工,它是利用聚光和光的非接触性在高速下进行加工,可以实现高精度加工。此外,它对地球环境是清洁的,是一种可以节省加工的资源。因此,激光加工作为一种新材料的加工方法被寄予厚望。然而,如果高成本的激光设备的性能和生产率比过去还没有得到证明,那么引入生产线可能会带来高昂的成本。因此,未来扩大激光加工的覆盖面和开发新的加工技术的尝试大大增加。…当三维自由方向钻孔成为可能时,新功能就可以添加到产品中。随着新的加工技术,如减少生产工艺和零件数量,扩大材料的覆盖范围,这将产生很大的影响。本研究的目的是通过提出一种新的玻璃陶瓷三维激光加工方法,将高质量和高精度的三维钻孔应用于自由方向。结果,发展了如下所示的方法,并实现了其在三维钻孔中的应用。无裂纹加工方法需要在工件表面进行无裂纹加工,然后将熔体分散到空气中。根据实验结果发现,用涂料连续地对激光进行吸收,可以在激光表面形成无裂纹的孔洞。三维钻孔研究了钻孔的生长机理。通过观察和分析发现,这种生长是通过孔底熔化层来实现的。在此基础上,提出并讨论了一种新型的无裂纹三维激光加工方法。孔洞始终沿激光入射方向打孔,通过改变入射方向实现了无裂纹的三维打孔。深孔钻探的发展本研究对深孔施工方法进行了试验研究,以实现高精度、高质量的深孔三维钻孔。结果,通过上下两个方向的激光照射,解决了孔洞填充的问题。利用化学方法进行三维钻孔的发展实验结果证明,通过蚀刻可以逐渐去除孔内的粘附层和影响层,从而获得高质量的加工孔。这种方法使玻璃内部空间和螺旋加工成为可能。因此,生产工艺和零件数量的减少等各种效果是可以预期的。在其他材料上的应用本研究证实了这种三维钻孔方法可以应用于钠钙玻璃和碱性玻璃等。较少
英文摘要
In recent years, the additional value of product, low costs, high product-mix and proper-repetitive production and a harmony with the earth environment are pursued in the manufacturing industry. The laser processing which is different from the conventional mechanical and chemical processing has been by the collection light and the non-contact-ability of the light in a high-speed and can realize high accuracy machining. Moreover, it is clean to the earth environment, as a kind of resource which can save machining. Therefore, the laser processing is highly expected as a method of the processing of new material, the micromachining.However, if that the performance and the productivity of the laser equipment with high cost become better than that in the past hasn't been proved the introduction into the production line may be of high cost. Therefore the attempts to expand the coverage of the laser processing in the future and the development of a new processing technology are much regained.I … More f the free direction drilling in 3-dimensional becomes possible, the new feature can be added to the product. This can expect a big effect as the new processing technology such as the reduction of the production process and the number of parts, the expansion of the coverage of the material.The purpose of this research is to apply a high quality and high accuracy 3- dimensional drilling to the free direction by proposing a newly 3-dimensional laser processing method to Glass-ceramics.As a result, that the method shown below has been developed and the application of which into 3-dimensional drilling was realized.1. The crack-free processing methodIt was necessary to create a crack-free processing on the surface of workpiece and then to scatter the melt into the air. According to the experimental results, it was found that a crack-free drilled hole could be processed when YAG laser beam irradiated on the surface with paints applied to absorb the laser beam continuously.2. The 3-dimensional drillingThe mechanism of growth of the drilled hole was examined. Through observation and analysis, it was found that the growth could be attained by melted layer on the bottom of a hole. Then, a new crack-free and 3-dimensional YAG laser processing method was developed and discussed. The holes are always drilled along the incident direction of laser, a crack-free and 3-dimensional drilled hole was realized by changing the YAG laser incident direction.3. Development of deep drillingThis research conducted some examination on the deep drilling method of construction to realize a deeper 3-dimensional drilling with high accuracy and quality. As a result, the problem of a filled hole was solved by irradiating a laser from the upper and lower direction.4. The development of the 3-dimensional drilling method using a chemical operationThe experimental results proved that the adhesion and affected layer can be removed gradually from inside the hole by using an etching, which can give a high quality processing hole.This way makes the inner space and the spiral processing become possible in the glass. Therefore, the various effects such as the reduction of the production process and the number of parts can be expected.5. The application to the other materialThis research confirmed that it is possible to apply this 3-dimensional drilling method to soda lime glass and alkaline glass and so on. Less
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橋本隆寛, 池野順一, 中野康範, 堀内宰, 河西敏雄: "YAGレーザによるガラス表面の微細加工(第3報)〜任意形状の凸部平面創成〜"精密工学会講演論文集. 277 (2000)
Takahiro Hashimoto、Junichi Ikeno、Yasunori Nakano、Osamu Horiuchi、Toshio Kawanishi:“使用 YAG 激光进行玻璃表面的微加工(第 3 次报告)- 任意形状的凸面的创建 -”日本精密工程学会论文集 277(2000 年)。
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D.Sawaki, J.Ikeno, O.Horiuchi, T.Kasai: "Three Dimensional Micro-assembly Technique Applying Laser Trapping"Proceedings of LPM2000. 110-114 (2000)
D.Sawaki、J.Ikeno、O.Horiuchi、T.Kasai:“应用激光捕获的三维微组装技术”LPM2000 论文集。
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T.Hashimoto, J.Ikeno, O.horiuchi, T.Kasai: "Micro-processing of Glass"Proceeding of JSGE. ABTEC2000. 345-346 (2000)
T.Hashimoto、J.Ikeno、O.horiuchi、T.Kasai:《玻璃微加工》JSGE 论文集。
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橋本隆寛,池野順一,堀内宰: "YAGレーザによるガラス表面の微細加工〜微細塑性加工の検討〜"精密工学会講演論文集. 220 (2000)
Takahiro Hashimoto、Junichi Ikeno、Osamu Horiuchi:“使用 YAG 激光对玻璃表面进行微加工 - 微塑料加工的检查 -”日本精密工程学会论文集 220 (2000)。
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"Study on new arrangement technique of fine particles by laser beam (1st report, arrangement and motion control of fine particles in the water)"Transaction of the japan society of mechanical engineers. 65-636 (C). 3452-3457 (1999)
《利用激光束对微粒进行新排列技术的研究(第1次报告,水中微粒的排列和运动控制)》《日本机械工程学会学报》。
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共 29 条
Study on latent scratch detection method of mirror surface by pulse laser
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Study on an Intelligent laser slicing method of both hard and brittle materials
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财政年份:2011
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A new laser micro-machining to add a glass high value
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财政年份:2009
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Study on New three dimensional laser micro machiing for manufacturing of aspheric lens
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New Assembly Technique of Three Dimensional Micro-structure by YAG Laser Beam
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Study on a micro-maching appoying the lasertrapping of fine abrasives.
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批准号:06555033
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资助金额:$4.48万
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财政年份:1994
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负责人:IKENO Junichi
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依托单位:
海外基金