Creation of Nano-device/CMOS Merged Three Dimensional Integrated Circuits Using Shape-Functionalized Micro-interconnect

使用形状功能化微互连创建纳米器件/CMOS 合并三维集成电路

• 批准号: 21246061
• 负责人: ASANO Tanemasa
• 金额: $ 30.37万
• 依托单位: Kyushu University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A)
• 财政年份: 2009
• 资助国家: 日本
• 起止时间: 2009 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-21246061/
• 关键词: 電子デバイス・集積回路; インターコネクト・パッケージのシステム化応用; センシングデバイス; 三次元集積回路; 3D-LSI; インターコネクト; マイクロ接合; 常温接合; プリンティッドエレクトロニクス; フレキシブルエレクトロニクス; 超音波接合; クロコン酸; バンプ; 先鋭バンプ; ヘテロ集積

Bonding mechanism of cone-shaped microbump electrode, which was invented by the leader of this project research, has been investigated. Application of the mechanism to development of three dimensional integration of semiconductor circuits has also been investigated. This project achieved room temperature bonding of high density micro interconnect, which was not able to carry out using existing technology. The developed technology has been applied to integration of heterogeneous integration on silicon. As anexample, a high-resolution near infrared image sensor has been fabricated using the developed technology.

研究了本课题负责人发明的锥形微凸点电极的键合机理。应用该机制开发三维集成的半导体电路也进行了研究。该项目实现了现有技术无法实现的高密度微互连的室温键合。所开发的技术已应用于硅上异构集成的集成。作为一个例子，一个高分辨率的近红外图像传感器已被制造使用开发的技术。

项目成果

Self-heating issue of poly-Si TFT on glass substrate

玻璃基板上多晶硅TFT的自热问题

• 发表时间: 2011
• 作者: ワサンタマーラー・バダラワ;松井裕章;蓮池紀幸;播磨弘;田畑仁;Tanemasa Asano
• 通讯作者: Tanemasa Asano

Compliant Bump Technology for Back-Side Illuminated CMOS Image Sensor

适用于背面照明 CMOS 图像传感器的兼容凸块技术

• 发表时间: 2009
• 期刊: Proc. 2009 Int. Electronic Components and Techn ology Conference"
• 作者: T.Asano;N.Watanabe;I.Tsunoda;Y.Kimiya;K.Fukunaga;M.Handa;H.Arao;Y.Yamaji;M.Aoyagi;T.Higashimachi;K.Tanaka;T.Takao;K.Matsumura;A.Ikeda;Y.Kuroki;T.Tsurushima
• 通讯作者: T.Tsurushima

Selective Heating of Microbumps Using Microwave for Low Strain Heterogeneous Chip Stack Integration

使用微波选择性加热微凸块以实现低应变异质芯片堆栈集成

• 发表时间: 2011
• 期刊: Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials
• 作者: L.Qiu;T.Asano
• 通讯作者: T.Asano

Room Temperature Microjoining of qVGA Class Area-Bump Array Using Cone Bump

使用锥形凸块的 qVGA 级区域凸块阵列的室温微连接

• 发表时间: 2012
• 作者: T. Shuto;K. Iwanabe;L. Qiu;and T. Asano
• 通讯作者: and T. Asano

Room-Temperature Microjoining of LSI Chips on Poly(ethylene naphthalate) Film Using Mechanical Caulking of Au Cone Bump

使用金锥体凸点机械填缝将 LSI 芯片室温微接合在聚萘二甲酸乙二醇酯薄膜上

• DOI: 10.1143/jjap.51.04db04
• 发表时间: 2012
• 期刊: Jpn. J. Appl. Phys
• 作者: T. Shuto;N. Watanabe;A. Ikeda;and T. Asano
• 通讯作者: and T. Asano