Fundamental Research of Single-Atomic Memories
单原子存储器的基础研究
基本信息
- 批准号:03452083
- 负责人:
- 金额:$ 1.28万
- 依托单位:
- 依托单位国家:日本
- 项目类别:Grant-in-Aid for General Scientific Research (B)
- 财政年份:1991
- 资助国家:日本
- 起止时间:1991 至 1992
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
This research project aims fundamental research for developing a new type memory which enables to memorize a unit of digital information in an atomic size. In this fiscal year, development of a manufacturing process for Si tips which can be used for electron emission by the tunneling phenomenon and development of a micron-size field emitters. For characterization of Si tips, we have developed a unique "in-situ" measurement system by which we are able to reveal effects of annealing, environment, etc. The following summarize results of this fiscal year.(1) Ar ion sputtering is effective in sharpening of Si tips which have been prepared by anisotropic wet chemical etching using such chemicals as KOH. As a result, we can fabricate tip with tip radius of about 10nm.(2) The surface of Si tips fabricated by Ar ion sputtering is damaged. But it can be annealed out at 600゚C or above, and it results in a field emission of electrons superior to Si tips fabricated by other processes. The field emission characteristic is improved with increasing annealing temperature up to about 800゚C. This is because of surface cleaning. But annealing at 900゚C results in degradation of the field emission characteristic due to restructuring of the tip apex.(3) The field emission current from Si tips can be drastically improved by operating in bydrogen ambient. This is due to change in surface state density distribution.(4) Noise of emission current from a Si tip in vacuum shows the 1/f characteristic, while that of a tip in hydrogen depends on 1/f^n (n>1). This sggests that the noise originates from the combination of surface migration and adsorption/desorption of atoms.(5) A new self-aligned process for fabrication of micron size field emitter by usingsputter evaporation has been developed.
这个研究项目旨在进行基础研究,以开发一种新型存储器,使其能够在原子大小的范围内存储一个单位的数字信息。在本财政年度,开发了一种可用于隧道现象的电子发射的硅尖的制造工艺,并开发了微米尺寸的场发射器。为了表征Si尖端,我们开发了一种独特的“原位”测量系统,通过该系统,我们能够揭示退火,环境等的影响。以下是本财政年度的总结结果。(1)氩离子溅射对各向异性湿法化学刻蚀制备的硅尖有较好的锐化效果。因此,我们可以制造出尖端半径约为10nm的尖端。(2)氩离子溅射制备的Si针尖表面存在损伤。但它可以在600℃或更高的温度下退火,并且它的场发射电子优于其他工艺制备的Si尖端。随着退火温度的升高,其场发射特性得到改善,退火温度可达800℃左右。这是由于表面清洗。但在900℃的温度下退火,由于尖端的重构导致了场发射特性的下降。(3)在含氢环境下,硅尖端的场致发射电流显著提高。这是由于表面态密度分布的变化。(4)真空中硅尖的发射电流噪声表现为1/f特征,而氢尖的发射电流噪声表现为1/f^n (n>1)。这表明噪声来自于原子的表面迁移和吸附/解吸的结合。(5)提出了一种利用溅射蒸发制备微米级场发射极的自对准新工艺。
项目成果
期刊论文数量(22)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
T.Asano and R.Kajiwara: "Fabrication of a Tunnel Sensor with a Cantilever Structure" Tech.Dig.4th Ion.Vacuum Microelectronics Conf.204-205 (1991)
T.Asano 和 R.Kajiwara:“具有悬臂结构的隧道传感器的制作”Tech.Dig.4th Ion.Vacuum Micro electronics Conf.204-205 (1991)
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
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- 通讯作者:
T.Asano and T.Tamon: "Fabrication of Si Tips by Ar Ion Sputtering" Tech.Dig.4th Ion.Vacuum Microelectronics Conf.88-89 (1991)
T.Asano 和 T.Tamon:“通过 Ar 离子溅射制造 Si 尖端”Tech.Dig.4th Ion.Vacuum Micro electronics Conf.88-89 (1991)
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
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- 通讯作者:
T.Asano and T.Tamon: "Emission Characteristic of a Micron-Size Si Field Emitter Fabricated by Ion Sputtering" Proc.Int.Workshop on Electron Beam Assisted Processes. 143-149 (1993)
T.Asano 和 T.Tamon:“离子溅射制造的微米级硅场发射器的发射特性”Proc.Int.电子束辅助工艺研讨会。
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
T. Asano and T. Tamon: "Fabrication of Si Tips by Ar Ion Sputtering" Tech. Dig. 4th Int. Vacuum Microelectronics Conf.88-89 (1991)
T. Asano 和 T. Tamon:“通过氩离子溅射制造硅尖端”技术。
- DOI:
- 发表时间:
- 期刊:
- 影响因子:0
- 作者:
- 通讯作者:
T. Asano and R. Kajiwara: "Fabrication of Tunnel Sensor with a Cantilever Structure" Tech. Dig 4th Int. Vacuum Microelectronics Conf.204-205 (1991)
T. Asano 和 R. Kajiwara:“悬臂结构隧道传感器的制造”技术。
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- 影响因子:0
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ASANO Tanemasa其他文献
ASANO Tanemasa的其他文献
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{{ truncateString('ASANO Tanemasa', 18)}}的其他基金
Study on high-speed doping mechanism of wet laser processing
湿法激光加工高速掺杂机理研究
- 批准号:
25289105 - 财政年份:2013
- 资助金额:
$ 1.28万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Creation of Nano-device/CMOS Merged Three Dimensional Integrated Circuits Using Shape-Functionalized Micro-interconnect
使用形状功能化微互连创建纳米器件/CMOS 合并三维集成电路
- 批准号:
21246061 - 财政年份:2009
- 资助金额:
$ 1.28万 - 项目类别:
Grant-in-Aid for Scientific Research (A)
Study of the Formation of Single-Crystal Silicon Thin-Film Using Nanoimprint Seeding
纳米压印晶种形成单晶硅薄膜的研究
- 批准号:
18360025 - 财政年份:2006
- 资助金额:
$ 1.28万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Position and Orientation Control of Si Thin-Film Crystal Grain Using Nano-Imprint Technology
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- 批准号:
15360022 - 财政年份:2003
- 资助金额:
$ 1.28万 - 项目类别:
Grant-in-Aid for Scientific Research (B)
Thin-Film-Transistor and Its Layr-Structured Circuitry for Signal Prosessing Based on Probability
基于概率的薄膜晶体管及其层状信号处理电路
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08650406 - 财政年份:1996
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$ 1.28万 - 项目类别:
Grant-in-Aid for Scientific Research (C)
Investigation of Electron-Wave Interference Vacuum Microelectronics Devices
电子波干涉真空微电子器件研究
- 批准号:
05555010 - 财政年份:1993
- 资助金额:
$ 1.28万 - 项目类别:
Grant-in-Aid for Developmental Scientific Research (B)
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