INTERCONNECTION OF FUNCTIONAL MATERIALS BY MEANS OF A SURFACE ACTIVATION METHOD IN ULTRAHIGH VACUUM
INTERCONNECTION OF FUNCTIONAL MATERIALS BY MEANS OF A SURFACE ACTIVATION METHOD IN ULTRAHIGH VACUUM
批准号:
01044040
负责人:
SUGA Tadatomo
金额:
$2.24万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for international Scientific Research
财政年份:
1989
资助国家:
日本
项目状态:
已结题
起止时间:
1989 至 --
中文摘要
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英文摘要
Bonding experiments were made both in an ultrahigh vacuum bonding apparatus of Max-Planck Institute and in a regular high vacuum apparatus of the University of Tokyo. Transmission electron microscopy showed that microstructure of the Al-Al interfaces was affected by the presence of residual gases in the bonding apparatus and that an atomic direct bonding between two solids was really achieved in a clean atomosphere by the surface activation method.
期刊论文(2)
专著(0)
科研奖励(0)
会议论文
Tadatomo, Suga: "TEM Observation of the Al/Al Interfaces Prepared in an Ultrahigh Vacuum at Room Temperture" Journal of the Japan Institute of Metals.
Tadatomo, Suga:“室温超高真空中制备的 Al/Al 界面的 TEM 观察”日本金属研究所杂志。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
Tadatomo, Suga: "Ceramic-Metal Bonding at Room Temperture" Proc. the Japan Institute of Metals (1989) Sep.104-105 (1989)
Tadatomo, Suga:“室温下的陶瓷金属接合”Proc。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
New Method for Room Temperature Bonding at Ambient Gas
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-
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依托单位:
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依托单位:
海外基金