INTERCONNECTION OF FUNCTIONAL MATERIALS BY MEANS OF A SURFACE ACTIVATION METHOD IN ULTRAHIGH VACUUM

通过超高真空表面活化方法实现功能材料的互连

• 批准号: 01044040
• 负责人: SUGA Tadatomo
• 金额: $ 2.24万
• 依托单位: University of Tokyo
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for international Scientific Research
• 财政年份: 1989
• 资助国家: 日本
• 起止时间: 1989 至 无数据
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-01044040/
• 关键词: Room Temperture Bonding; Ultrahigh Vacuum; Surface Activation; microstructure of Interface; Direct Bonding

Bonding experiments were made both in an ultrahigh vacuum bonding apparatus of Max-Planck Institute and in a regular high vacuum apparatus of the University of Tokyo. Transmission electron microscopy showed that microstructure of the Al-Al interfaces was affected by the presence of residual gases in the bonding apparatus and that an atomic direct bonding between two solids was really achieved in a clean atomosphere by the surface activation method.

在Max-Planck研究所的高真空键合装置和东京大学的常规高真空装置中进行了键合实验。透射电子显微镜观察表明，Al-Al界面的微观结构受键合装置中残余气体的影响，通过表面活化方法，在清洁的气氛中实现了两种固体之间的原子直接键合。

项目成果

Tadatomo, Suga: "TEM Observation of the Al/Al Interfaces Prepared in an Ultrahigh Vacuum at Room Temperture" Journal of the Japan Institute of Metals.

Tadatomo, Suga：“室温超高真空中制备的 Al/Al 界面的 TEM 观察”日本金属研究所杂志。

Tadatomo, Suga: "Ceramic-Metal Bonding at Room Temperture" Proc. the Japan Institute of Metals (1989) Sep.104-105 (1989)

Tadatomo, Suga：“室温下的陶瓷金属接合”Proc。